A variety of metallic powders were mixed with tin in 10:90 weight ratios and cold sprayed onto thermosetting epoxy carbon fiber-reinforced polymers (CFRPs) substrates with varying surface finishes, and onto a thermoplastic polyether-ether-ketone (PEEK)-CFRP. Where previous studies focused on understanding the impact of the secondary component (SC) on the deposition efficiency (DE) of tin, this study aims to explore the pull-off strength and electrical conductivity of the deposited coatings. An extensive study on fractured surfaces highlighted that better adhesion usually arose from increased potential to mechanically interlock with a feature at the surface such as carbon fibers or surfacing elements. The polymeric nature of the composite resin was observed to affect the pull-off strengths as the ductile thermoplastic PEEK seems to absorb more of the impinging particle energy. The pull-off strengths were then related to the SC properties, and it was observed that the better coating strengths were obtained with SC that were previously reported to be detrimental to pure Sn deposition. Finally, four-point resistivity/conductivity measurements were carried out and results were generally better than those previously reported in the literature (50-80% the conductivity of bulk tin), with variations being associated with differing bonding quality within the coatings.

各种金属粉末与锡以 10:90 的重量比混合，然后冷喷涂到具有不同表面光洁度的热固性环氧碳纤维增强聚合物 (CFRP) 基材上，以及热塑性聚醚醚酮 (PEEK)-CFRP 上。以前的研究主要集中在了解次要成分 (SC) 对锡沉积效率 (DE) 的影响，而本研究旨在探索沉积涂层的剥离强度和电导率。对断裂表面的广泛研究强调，更好的附着力通常源于与表面特征（如碳纤维或表面元素）机械互锁的可能性增加。观察到复合树脂的聚合物性质会影响拉断强度，因为韧性热塑性 PEEK 似乎吸收了更多的撞击粒子能量。然后将剥离强度与 SC 特性相关联，并且观察到使用 SC 获得了更好的涂层强度，而之前据报道这对纯 Sn 沉积是有害的。最后，进行了四点电阻率/电导率测量，结果通常优于文献中先前报道的结果（体锡的电导率的 50-80%），变化与涂层内不同的粘合质量有关。并且观察到使用 SC 获得了更好的涂层强度，而之前据报道这对纯 Sn 沉积是有害的。最后，进行了四点电阻率/电导率测量，结果通常优于文献中先前报道的结果（体锡的电导率的 50-80%），变化与涂层内不同的粘合质量有关。并且观察到使用 SC 获得了更好的涂层强度，而之前据报道这对纯 Sn 沉积是有害的。最后，进行了四点电阻率/电导率测量，结果通常优于文献中先前报道的结果（体锡的电导率的 50-80%），变化与涂层内不同的粘合质量有关。