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Effect of clay minerals on copper reclamation from leached solution
Indian Journal of Chemical Technology ( IF 0.5 ) Pub Date : 2022-05-17
Murugesan Manikkampatti Palanisamy, Venkata Ratnam Myneni, Akilamudhan Palaniyappan

The present investigation focus on the recovery of copper (Cu) ions from printed circuit boards (PCBs) by applying simultaneous treatment of leaching and adsorption, as a novel approach. The PCBs are subjected to chemical leaching using aqua regia resulted in a Cu recovery of 97.06%. The leached solution is treated for removal of Cu with activated bent clay as an adsorbent. The optimum condition of process variables is found through central composite design-response surface methodology (RSM-CCD). The maximum %Cu removal of 97.33% is obtained at the optimum operating conditions of adsorbent size of 0.04 mm, adsorbent dosage of 3.5 g.L-1 and the temperature of 80C with 0.845 desirability. This investigation is found to be an eco-friendly way to recover copper ions and does not cause any environmental issues.

中文翻译:

粘土矿物对浸出液回收铜的影响

目前的研究重点是通过同时处理浸出和吸附来从印刷电路板 (PCB) 中回收铜 (Cu) 离子,这是一种新方法。使用王水对 PCB 进行化学浸出,铜回收率为 97.06%。用活性弯曲粘土作为吸附剂处理浸出溶液以去除铜。通过中心复合设计-响应面法(RSM-CCD)找到过程变量的最佳条件。在吸附剂尺寸为 0.04 mm、吸附剂用量为 3.5 gL-1 和温度为 80C 的最佳操作条件下获得了 97.33% 的最大铜去除率,合意度为 0.845。这项调查被发现是一种回收铜离子的环保方式,不会造成任何环境问题。
更新日期:2022-05-17
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