The present investigation focus on the recovery of copper (Cu) ions from printed circuit boards (PCBs) by applying simultaneous treatment of leaching and adsorption, as a novel approach. The PCBs are subjected to chemical leaching using aqua regia resulted in a Cu recovery of 97.06%. The leached solution is treated for removal of Cu with activated bent clay as an adsorbent. The optimum condition of process variables is found through central composite design-response surface methodology (RSM-CCD). The maximum %Cu removal of 97.33% is obtained at the optimum operating conditions of adsorbent size of 0.04 mm, adsorbent dosage of 3.5 g.L-1 and the temperature of 80C with 0.845 desirability. This investigation is found to be an eco-friendly way to recover copper ions and does not cause any environmental issues.

中文翻译：

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粘土矿物对浸出液回收铜的影响

目前的研究重点是通过同时处理浸出和吸附来从印刷电路板 (PCB) 中回收铜 (Cu) 离子，这是一种新方法。使用王水对 PCB 进行化学浸出，铜回收率为 97.06%。用活性弯曲粘土作为吸附剂处理浸出溶液以去除铜。通过中心复合设计-响应面法（RSM-CCD）找到过程变量的最佳条件。在吸附剂尺寸为 0.04 mm、吸附剂用量为 3.5 gL-1 和温度为 80C 的最佳操作条件下获得了 97.33% 的最大铜去除率，合意度为 0.845。这项调查被发现是一种回收铜离子的环保方式，不会造成任何环境问题。