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Investigations of Heat Sink Property of a Novel Dual Linear Polarized Low Cross-Polarization X-Band Phased Array Antenna Employing Silicon RFICs-Based Beamforming Network
IEEE Open Journal of Antennas and Propagation Pub Date : 2022-04-27 , DOI: 10.1109/ojap.2022.3170791
Rudraishwarya Banerjee 1 , Satish Kumar Sharma 1 , Jia-Chi Samuel Chieh 2 , Raif Farkouh 2
Affiliation  

In this paper, investigations on heat sink property of a 4x2 wideband dual linear polarized phased array antenna comprised of 3D metal printed all metallic radiators, serving also as heat sink, is presented for X-band frequency. Two single radiators, each with a height nearly equal to ${\lambda }$ /2 corresponding to center frequency (9.50 GHz), shaped intuitively and placed orthogonal to each other and surrounded by a metal ring of square cross-section with overall dimension of ${\lambda }/2\times {\lambda }$ /2, constitutes the dual linear polarized radiating element. Both radiators are fed by an orthogonal arrangement of stripline feeds through a trapezium shaped metal plate, which in turn helps to integrate the antenna aperture with the beamforming network (BFN). A set of via fences are placed beneath each antenna element, which work as a thermal path between the BFN and antenna aperture. This radiating element resembles heat fins, and designed to cover 8.5-11.5 GHz impedance bandwidth. Good radiation pattern with low cross-polarization is obtained over the entire bandwidth, while the peak broadside gain is varying between 14–11 dBi. Beam scans are viable ±50° in ${\varphi }=0^{0}$ plane and ±30° in ${\varphi }=90^{0}$ plane. The array antenna aperture is built using 3D metal printing technology. The BFN is comprised of commercial silicon Radio Frequency Integrated Circuit (RFIC) chips which have been integrated with the antenna aperture. A beamforming algorithm is applied through serial peripheral interface (SPI) controller to achieve beam steering during the measurement process. The temperature reduction of 60°C is achieved with the heat sink structure when the temperature distribution of BFN with and without heat sink are compared for the 4x2 array. The temperature of the heat sink antenna is only 41°C and the temperature distribution is validated with an infrared (IR) camera.

中文翻译:

采用基于硅 RFIC 的波束成形网络的新型双线性极化低交叉极化 X 波段相控阵天线的散热性能研究

在本文中,研究了由 3D 金属打印的全金属辐射器组成的 4x2 宽带双线性极化相控阵天线的散热器特性,该天线也用作 X 波段频率的散热器。两个单个散热器,每个散热器的高度几乎等于 ${\lambda }$ /2 对应于中心频率 (9.50 GHz),形状直观,彼此正交放置,周围环绕着方形横截面的金属环,整体尺寸为 ${\lambda }/2\times {\lambda }$ /2,构成双线偏振辐射元件。两个辐射器通过梯形金属板的正交布置的带状线馈电馈电,这反过来有助于将天线孔径与波束成形网络 (BFN) 集成。一组通孔栅栏放置在每个天线元件下方,作为 BFN 和天线孔径之间的热路径。该辐射元件类似于散热片,设计用于覆盖 8.5-11.5 GHz 阻抗带宽。在整个带宽上获得了具有低交叉极化的良好辐射图,而峰值宽边增益在 14-11 dBi 之间变化。光束扫描在 ±50° 范围内是可行的 ${\varphi }=0^{0}$平面和±30° ${\varphi }=90^{0}$飞机。阵列天线孔径是使用 3D 金属打印技术构建的。BFN 由与天线孔径集成的商用硅射频集成电路 (RFIC) 芯片组成。通过串行外围接口 (SPI) 控制器应用波束成形算法,以在测量过程中实现波束控制。当比较 4x2 阵列的 BFN 有无散热片的温度分布时,采用散热片结构实现了 60°C 的温度降低。散热器天线的温度仅为 41°C,温度分布通过红外 (IR) 摄像头进行验证。
更新日期:2022-04-27
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