Copper ion conducting solid electrolyte Rb₄Cu₁₆I_6.5Cl_13.5 was prepared by means of mechano-chemical method. The structure and morphology of the powder was investigated by x-ray diffraction and scanning electron microscopy. The grain size was estimated to be 0.2–0.9 μm and the ionic conductivity at room temperature was approximately 0.206 S/cm. The solid electrolyte Rb₄Cu₁₆I_6.5Cl_13.5 was exploited for copper ion beam generation. The copper ion emission current of several nA was successfully obtained at acceleration voltages of 15 kV and temperature of 197 °C in vacuum of 2.1 × 10⁻⁴ Pa. A good linear correlation between the logarithmic ion current (log I) and the square root of the acceleration voltage (U _acc) at high voltage range was obtained, suggesting the Schottky emission mechanism in the process of copper ion beam generation.

中文翻译：

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固体电解质中的铜离子束发射 Rb4Cu16I6.5Cl13.5

采用机械化学法制备了铜离子导电固体电解质Rb ₄ Cu ₁₆ I _6.5 Cl _{13.5 。}通过X射线衍射和扫描电子显微镜研究了粉末的结构和形态。晶粒尺寸估计为 0.2–0.9 μm，室温下的离子电导率约为 0.206 S/cm。固体电解质 Rb ₄ Cu ₁₆ I _6.5 Cl _13.5被用于产生铜离子束。^{在 2.1 × 10 -4}的真空中，在 15 kV 的加速电压和 197 °C 的温度下成功获得了几个 nA 的铜离子发射电流Pa. 对数离子电流 (log我) 和加速电压的平方根 (ü _acc ) 在高电压范围内获得，表明铜离子束产生过程中的肖特基发射机制。