The surfactant-enhanced gas sparging process designed to specifically target the source zone of an organic contaminant in an aquifer with minimal usage of injected additives was investigated using a physical model. Aqueous solutions of the anionic surfactant Sodium dodecylbenzne sulfonate (SDBS) and/or the thickener Sodium carboxymethylcellulose (SCMC) were applied in a contaminated horizontal layer in the simulated laboratory aquifer model followed by gas sparging. Fluorescein sodium salt (FSS) was added to the SDBS/SCMC solutions and represented the organic contaminant. Air and ozone were injected to generate gas sparging. A modified surfactant-enhanced ozone sparging method was also tested by applying additional air venting ports installed in the aquifer above the gas injection zone. Both non-aqueous phase liquid (NAPL) and water-dissolved TCA were applied to the SDBS-applied region to evaluate the removal of contaminants during gas sparging. A significant expansion of the de-saturated zone for the SDBS-applied region was observed during air sparging. During ozone sparging, the fluorescence by FSS in the SDBS-applied layer disappeared over a much wider range than that of the control experiment. SCMC application enhanced the performance of the SDBS-applied gas sparging process. The TCA mass removed by volatilization during air sparging from the SDBS-applied layer was 2.3 times the application in the absence of SDBS. Among five regions of injected NAPL contamination located above the single gas injection port, and during 2 h of ozone sparging, with SDBS applied, more than 50% of fluorescence in the NAPL was removed, whereas under the same conditions with no SDBS applied, less than 30% was removed. Diverted gas flow through the venting ports installed in the aquifer model induced a horizontally expanded oxidative reaction zone during ozone sparging. This study demonstrates enhanced gas sparging performance for the removal of contaminants from the aquifer with limited usage of additives applied specifically to the source zone.

使用物理模型研究了表面活性剂增强型气体喷射工艺，该工艺旨在专门针对含水层中有机污染物的源区，并使用最少的注入添加剂进行研究。阴离子表面活性剂十二烷基苯磺酸钠 (SDBS) 和/或增稠剂羧甲基纤维素钠的水溶液(SCMC) 应用于模拟实验室含水层模型中的污染水平层，然后进行气体喷射。将荧光素钠盐 (FSS) 添加到 SDBS/SCMC 溶液中并代表有机污染物。注入空气和臭氧以产生气体喷射。通过在注气区上方的含水层中安装额外的排气口，还测试了一种改进的表面活性剂增强臭氧喷射方法。非水相液体 (NAPL) 和水溶解的TCA 均应用于 SDBS 应用区域，以评估气体喷射过程中污染物的去除情况。观察到 SDBS 应用区域的去饱和区显着扩大。空气喷射。在臭氧喷射期间，SDBS 应用层中 FSS 的荧光消失的范围比对照​​实验大得多。SCMC 应用提高了应用 SDBS 的气体喷射过程的性能。在空气喷射期间从 SDBS 应用层中通过挥发去除的 TCA 质量是不存在 SDBS 时应用的 2.3 倍。在位于单个气体注入口上方的五个注入 NAPL 污染区域中，在 2 小时的臭氧喷射期间，使用 SDBS，NAPL 中超过 50% 的荧光被去除，而在相同条件下，不使用 SDBS，更少超过 30% 被删除。通过安装在含水层模型中的排气口的分流气流在臭氧喷射期间引起水平扩展的氧化反应区。