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Preparation of nanoporous copper foil by chemical dealloying from electro-deposited CuZn alloy
Transactions of the IMF ( IF 1.9 ) Pub Date : 2022-03-14 , DOI: 10.1080/00202967.2021.2022836
Peng-Kang Du 1 , Zhen Sun 1 , Xiao-Wei Fan 1 , Yun-Zhi Tang 1 , Yong-fa Huang 2 , Ke-miao Yu 2 , Ping Wang 2 , Yu-Hui Tan 1 , Ning Song 1 , Yao Liu 1 , Yu-Song Zhang 1
Affiliation  

ABSTRACT

Nanoporous metals have been widely used in recent years for energy storage, catalysis and sensors due to their special structure and functional properties. One useful way to produce nanoporous metal is the dealloying approach. In this paper, the authors used seignette salt (NaKC4H4O6) as a coordinating agent to electrodeposit CuZn alloys under alkaline conditions, and then prepared the nanoporous copper foil through chemical corrosion dealloying. In order to study the electrochemical behaviour of the CuZn alloy electrodeposition process, cyclic voltammetry testing was carried out. The results show that the CuZn alloy electrodeposition is an irreversible reaction under diffusion control and follows the initial three-dimensional nucleation mechanism. The nucleation process is dominated by continuous nucleation. In addition, the surface crystal grains and zinc content increase with the increase of current density. After dealloying the CuZn alloy, the existence of nanoporous structure was confirmed by SEM (scanning electron microscopy). Under the optimum technical conditions, the pore size of the nanoporous copper foil is about 200–800 nm with thickness of the porous layer 2–5 μm. It is believed that this research offers an alternative pathway for designing nanoporous copper foil materials and related high performance for numerous applications.



中文翻译:

电沉积CuZn合金化学脱合金制备纳米多孔铜箔

摘要

纳米多孔金属由于其特殊的结构和功能特性,近年来被广泛用于储能、催化和传感器等领域。一种生产纳米多孔金属的有用方法是脱合金方法。在本文中,作者使用 seignette 盐 (NaKC 4 H 4 O 6)作为配位剂在碱性条件下电沉积CuZn合金,然后通过化学腐蚀脱合金制备纳米多孔铜箔。为了研究CuZn合金电沉积过程的电化学行为,进行了循环伏安测试。结果表明,CuZn合金电沉积是扩散控制下的不可逆反应,遵循初始的三维形核机制。成核过程以连续成核为主。此外,表面晶粒和锌含量随着电流密度的增加而增加。在对CuZn合金进行脱合金后,通过SEM(扫描电子显微镜)证实了纳米多孔结构的存在。在最佳技术条件下,纳米多孔铜箔的孔径约为200-800 nm,多孔层厚度为2-5 μm。相信这项研究为设计纳米多孔铜箔材料和适用于众多应用的相关高性能提供了一条替代途径。

更新日期:2022-03-14
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