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Plasma-controlled surface wettability: recent advances and future applications
International Materials Reviews ( IF 16.1 ) Pub Date : 2022-03-08 , DOI: 10.1080/09506608.2022.2047420
Chuanlong Ma 1 , Anton Nikiforov 1 , Dirk Hegemann 2 , Nathalie De Geyter 1 , Rino Morent 1 , Kostya (Ken) Ostrikov 3
Affiliation  

ABSTRACT

Materials with the desirable surface wettability are of key importance in diverse applications. However, most of the existing chemical processes used for surface wettability control are often energy-inefficient, pollute the environment, and rely on harsh processing conditions. Therefore, highly-selective, green, and low-cost alternative fabrication techniques are in urgent demand. Low-temperature plasma processing is one such promising approach that satisfies the above requirements. In this review, we present recent advances in plasma processing to control surface wettability for diverse emerging applications in the environment, energy, and biomedicine fields. The underlying mechanisms of the plasma surface engineering, key features of the fabrication processes, and water-surface interactions are discussed. This review aims to guide further development of the plasma processing to effectively control the surface wettability of various surfaces. This effort is poised to contribute to the development of advanced functional materials targeting a broad range of applications.



中文翻译:

等离子体控制的表面润湿性:最新进展和未来应用

摘要

具有理想表面润湿性的材料在各种应用中至关重要。然而,大多数用于表面润湿性控制的现有化学工艺往往能源效率低下、污染环境并且依赖于苛刻的工艺条件。因此,迫切需要高选择性、绿色和低成本的替代制造技术。低温等离子体处理是满足上述要求的一种很有前途的方法。在这篇综述中,我们介绍了等离子体处理的最新进展,以控制环境、能源和生物医学领域各种新兴应用的表面润湿性。讨论了等离子体表面工程的基本机制、制造过程的关键特征以及水-表面相互作用。本综述旨在指导等离子体处理的进一步发展,以有效控制各种表面的表面润湿性。这一努力有望促进针对广泛应用的先进功能材料的开发。

更新日期:2022-03-08
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