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Study on discharge characteristics and improving surface hydrophobicity of epoxy resin by nanosecond pulse excited argon/hexamethyldisiloxane jet array
High Voltage ( IF 4.4 ) Pub Date : 2022-02-23 , DOI: 10.1049/hve2.12194
Zhiyan Liu 1 , Jingang Xu 1 , Xi Zhu 1 , Feng Liu 1 , Zhi Fang 1
Affiliation  

Surface flashover of insulating materials induced by pollution and moisture environment is one of the main reasons for the damage of power system and electrical equipment. The improvement of the insulating materials surface hydrophobicity is key important, which can prevent the pollutants and water attachment, and enhance the insulating performance. In this paper, the super-hydrophobic film is formed on the surface of epoxy resin by a one-dimensional (1D) argon (Ar) jet array driven by nanosecond pulse power supply with hexamethyldisiloxane (HMDSO) addition. The influences of the processing time and HMDSO content on the epoxy resin surface hydrophobicity are investigated. It shows that with 0.04 % HMDSO, the jet array achieves a best hydrophobic treatment effect on the epoxy resin surface. After 60 s treatment, the apparent contact angle (ACA) of the epoxy resin surface increases from 60.3° of the untreated surface to 150.0°. The wettability of epoxy resin surface does not change too much as the treatment time beyond 60 s. The maximum ACA value 153.4° appears at 120 s processing time, which is just slightly higher than that of 60 s treatment time. The epoxy resin surface morphology and chemical feature before and after plasma processing are characteristics by the scanning electron microscopy (SEM), atomic force microscopy (AFM), Fourier transform infra-red spectroscopy and X-ray photoelectron spectroscopy. It shows that the treated epoxy resin surface is covered with dense coral like particles in nanoscales, the original C=O、C-H and other organic functional groups are replaced by Si-(CH3), Si-O-Si and other silicon containing groups, and the Si content increases from 0.4% to 28.0%. The experimental results provide important references to develop jet array as an efficient tool to enhance the surface hydrophobicity and insulating performance of insulating materials.

中文翻译:

纳秒脉冲激发氩/六甲基二硅氧烷射流阵列放电特性及提高环氧树脂表面疏水性的研究

污染和潮湿环境引起的绝缘材料表面闪络是造成电力系统和电气设备损坏的主要原因之一。绝缘材料表面疏水性的提高是关键,可以防止污染物和水的附着,提高绝缘性能。在本文中,通过添加六甲基二硅氧烷(HMDSO)的纳秒脉冲电源驱动的一维(1D)氩(Ar)射流阵列在环氧树脂表面形成超疏水膜。研究了处理时间和HMDSO含量对环氧树脂表面疏水性的影响。结果表明,在0.04 % HMDSO的情况下,射流阵列对环氧树脂表面的疏水处理效果最好。处理 60 s 后,环氧树脂表面的表观接触角 (ACA) 从未处理表面的 60.3° 增加到 150.0°。处理时间超过60 s,环氧树脂表面的润湿性变化不大。最大 ACA 值 153.4° 出现在 120 s 处理时间,仅略高于 60 s 处理时间。通过扫描电子显微镜(SEM)、原子力显微镜(AFM)、傅里叶变换红外光谱和X射线光电子能谱对等离子处理前后的环氧树脂表面形貌和化学特征进行表征。表明处理后的环氧树脂表面覆盖有纳米级致密的珊瑚状颗粒,原有的C=O、CH等有机官能团被Si-(CH 未处理表面的 3° 至 150.0°。处理时间超过60 s,环氧树脂表面的润湿性变化不大。最大 ACA 值 153.4° 出现在 120 s 处理时间,仅略高于 60 s 处理时间。通过扫描电子显微镜(SEM)、原子力显微镜(AFM)、傅里叶变换红外光谱和X射线光电子能谱对等离子处理前后的环氧树脂表面形貌和化学特征进行表征。表明处理后的环氧树脂表面覆盖有纳米级致密的珊瑚状颗粒,原有的C=O、CH等有机官能团被Si-(CH 未处理表面的 3° 至 150.0°。处理时间超过60 s,环氧树脂表面的润湿性变化不大。最大 ACA 值 153.4° 出现在 120 s 处理时间,仅略高于 60 s 处理时间。通过扫描电子显微镜(SEM)、原子力显微镜(AFM)、傅里叶变换红外光谱和X射线光电子能谱对等离子处理前后的环氧树脂表面形貌和化学特征进行表征。表明处理后的环氧树脂表面覆盖有纳米级致密的珊瑚状颗粒,原有的C=O、CH等有机官能团被Si-(CH 4°出现在120 s处理时间,略高于60 s处理时间。通过扫描电子显微镜(SEM)、原子力显微镜(AFM)、傅里叶变换红外光谱和X射线光电子能谱对等离子处理前后的环氧树脂表面形貌和化学特征进行表征。表明处理后的环氧树脂表面覆盖有纳米级致密的珊瑚状颗粒,原有的C=O、CH等有机官能团被Si-(CH 4°出现在120 s处理时间,略高于60 s处理时间。等离子处理前后的环氧树脂表面形貌和化学特征是通过扫描电子显微镜(SEM)、原子力显微镜(AFM)、傅里叶变换红外光谱和X射线光电子能谱表征的。表明处理后的环氧树脂表面覆盖有纳米级致密的珊瑚状颗粒,原有的C=O、CH等有机官能团被Si-(CH 傅里叶变换红外光谱和 X 射线光电子能谱。表明处理后的环氧树脂表面覆盖有纳米级致密的珊瑚状颗粒,原有的C=O、CH等有机官能团被Si-(CH 傅里叶变换红外光谱和 X 射线光电子能谱。表明处理后的环氧树脂表面覆盖有纳米级致密的珊瑚状颗粒,原有的C=O、CH等有机官能团被Si-(CH3 )、Si-O-Si等含硅基团,Si含量从0.4%提高到28.0%。实验结果为开发射流阵列作为提高绝缘材料表面疏水性和绝缘性能的有效工具提供了重要参考。
更新日期:2022-02-23
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