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IEEE Transactions on Electromagnetic Compatibility Call for Papers Special Issue/Section on “Electrostatic Discharge and Immunity – from IC to System”
IEEE Transactions on Electromagnetic Compatibility ( IF 2.1 ) Pub Date : 2022-02-17 , DOI: 10.1109/temc.2022.3149369
IEEE Transactions on Electromagnetic Compatibility ( IF 2.1 ) Pub Date : 2022-02-17 , DOI: 10.1109/temc.2022.3149369
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
中文翻译：
IEEE Transactions on Electromagnetic Compatibility Call for Papers Special Issue/Section on “Electrostatic Discharge and Immunity – from IC to System”
要求未来的作者提交新的、未发表的手稿，以包含在本征文中描述的即将举行的活动中。
更新日期：2022-02-18
中文翻译：
IEEE Transactions on Electromagnetic Compatibility Call for Papers Special Issue/Section on “Electrostatic Discharge and Immunity – from IC to System”
要求未来的作者提交新的、未发表的手稿，以包含在本征文中描述的即将举行的活动中。
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