The rapid advances in performance and miniaturization of electronic devices require a cooling technology that can remove the produced heat at a high rate with small temperature variations, as is obtained in flow boiling. To obtain insight in flow boiling, we performed numerical simulations in a 200 μm square microchannel using the local front reconstruction method. Besides validation with literature results, a parametric study shows an increasing heat removal rate and bubble growth rate with increasing wall temperature, liquid mass density, and liquid heat capacity and decreasing inlet velocity indicating the importance of phase change compared to convective transport. Finally, the heat transfer in the liquid film is studied using a Nusselt number defined with the film thickness, which is comparable to Nusselt number for falling films on hot surfaces. It is observed that convective effects are more pronounced at the bubble rear compared to the bubble front.

中文翻译：

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基于局部前沿重建法的微通道流动沸腾数值研究

电子设备的性能和小型化的快速进步需要一种冷却技术，该技术可以在温度变化很小的情况下以高速率去除产生的热量，就像在流动沸腾中获得的那样。为了深入了解流动沸腾，我们使用局部前沿重建方法在 200 μm 方形微通道中进行了数值模拟。除了用文献结果进行验证外，一项参数研究表明，随着壁温、液体质量密度和液体热容量的增加以及入口速度的降低，热去除率和气泡生长率增加，这表明与对流传输相比，相变的重要性。最后，使用由膜厚定义的努塞尔数来研究液膜中的传热，这与热表面上降膜的努塞尔数相当。可以观察到，与气泡前部相比，气泡后部的对流效应更为明显。