ABSTRACT

In this study, the effect of sodium dodecyl sulphate (SDS) on Cu electrodeposition was evaluated using cyclic voltammetry. With the weak adsorption of SDS on Cu and Au surfaces, SDS slightly altered the cyclic voltammogram for Cu electrodeposition on these surfaces. However, the cyclic voltammogram on glassy carbon (GC) and pyrolytic graphite significantly changed with the addition of SDS, indicating that the hydrophobic interactions are critical for SDS adsorption. SDS adsorbed on the GC surface exhibiting an increase in current response, an indication of the enhancement of Cu nucleation, confirmed by the increase in the nuclei density on the GC surface. Moreover, the addition of SDS splits the voltammetric wave on GC, indicating that SDS might stabilise Cu⁺ intermediates that are probably associated with SDS micelles. In addition, the micellar association might lower the diffusion coefficient of Cu²⁺ leading to a depression in the reduction peaks in the cyclic voltammograms.

摘要

在这项研究中，使用循环伏安法评估了十二烷基硫酸钠 (SDS) 对铜电沉积的影响。由于 SDS 在 Cu 和 Au 表面上的弱吸附，SDS 略微改变了这些表面上 Cu 电沉积的循环伏安图。然而，玻璃碳 (GC) 和热解石墨的循环伏安图随着 SDS 的添加而显着变化，表明疏水相互作用对 SDS 吸附至关重要。吸附在 GC 表面上的 SDS 表现出电流响应的增加，这表明 Cu 成核增强，通过 GC 表面上的核密度增加证实。此外，SDS 的加入使 GC 上的伏安波分裂，表明 SDS 可能稳定 Cu ⁺可能与 SDS 胶束有关的中间体。此外，胶束结合可能会降低Cu ²⁺的扩散系数，导致循环伏安图中的还原峰降低。