Skutterudite (SKD) thermoelectric materials have high conversion efficiency, great mechanical properties, and economical practicability in the medium temperature range (500–550 °C). They need to be joined with metal electrodes to form a thermoelectric power generation device during application. However, high contact resistivity, severe element diffusion, and large coefficient of thermal expansion mismatch are main obstacles for their applications. To address these issues, a FeCoNiCrMo high-entropy alloy diffusion barrier layer was designed and prepared using an arc smelting method in this paper. Effect of heating temperatures on the microstructure and properties of the bonded joints were investigated. The maximum shear strength was 21.6 Mpa and the corresponding reaction layer thickness, contact resistivity were 3.77 μm, 1.8 μΩcm² respectively at 600 °C, 40 MPa, 10 min. Shear strength dropped down to 18.8 MPa and the contact resistivity increased to 4.2 μΩ cm² after aging for 640 h. Numerical model was established and it predicted that the contact resistivity would keep lower than 6.5 μΩ cm² (300 h, 100 days) and 11 μΩ cm² (8760 h, 1 year) and the reaction layer thickness would not exceed 25 μm (2400 h, 100 days) and 45 μm (8760 h, 1 year).

方钴矿（SKD）热电材料在中温范围（500-550℃）内具有高转换效率、良好的机械性能和经济实用性。它们在应用过程中需要与金属电极连接形成热电发电装置。然而，高接触电阻率、严重的元素扩散和大的热膨胀系数失配是其应用的主要障碍。针对这些问题，本文采用电弧熔炼法设计制备了FeCoNiCrMo高熵合金扩散阻挡层。研究了加热温度对焊接接头微观结构和性能的影响。最大剪切强度为21.6 Mpa，对应的反应层厚度、接触电阻分别为3.77 μm、1.8 μΩcm²分别在 600 °C、40 MPa、10 分钟。老化640 h后，剪切强度下降至18.8 MPa，接触电阻率上升至4.2 μΩ cm ^{2 。}建立数值模型，预测接触电阻率将保持在6.5 μΩ cm ²（300 h，100天）和11 μΩ cm ²（8760 h，1年）以下，反应层厚度不超过25 μm（2400 h，100 天）和 45 μm（8760 小时，1 年）。