ABSTRACT

The connector used for electronic parts of automobiles is a type with Sn plating on the copper surface. In recent years, as the number of connector pins has increased and the insertion force has increased, problems have arisen in the insertion and removal operations. In addition, the reliability of the connection in high temperature environments needs to be improved. Various Sn plating alternative processes have been developed to meet these demands. Tha authors have previously reported on Sn-Cu plating processes that can provide more stable properties.^{1 H. Hayashi, N. Takaine, H. Funasaki and M. Watanabe: J. Surf. Finish. Soc. Jpn., 2020, 71(10), 630–635.[Crossref] , [Google Scholar]} Using Sn-Cu plating and Sn plating, a Cu₆Sn₅ intermetallic compound layer with low roughness formed just below the surface. A pure Sn layer is formed on it. The authors have previously reported that the formation of a pure Sn layer with high connection reliability and a stable hard intermetallic compound layer can be expected to improve various properties. In this study, as a result of investigating the solder wettability of this plating film, which has excellent low friction coefficient and low contact resistance, it was clarified that good connector characteristics can be obtained.

摘要

用于汽车电子零件的连接器是在铜表面镀锡的类型。近年来，随着连接器引脚数量的增加和插入力的增加，在插入和移除操作中出现了问题。此外，在高温环境下的连接可靠性也有待提高。已经开发了各种镀锡替代工艺来满足这些需求。Tha 作者之前曾报道过可以提供更稳定特性的 Sn-Cu 电镀工艺。^{1 H. Hayashi、 N. Takaine、 H. Funasaki和M. Watanabe： J. Surf。结束。社会。日本。, 2020 , 71 (10), 630 – 635。[Crossref]  , [Google Scholar]}使用镀Sn-Cu和镀Sn，一个Cu₆Sn₅在表面下方形成低粗糙度的金属间化合物层。在其上形成纯锡层。作者此前曾报道，形成具有高连接可靠性的纯锡层和稳定的硬金属间化合物层，有望改善各种性能。在这项研究中，通过研究这种具有优异的低摩擦系数和低接触电阻的镀膜的焊料润湿性，结果表明可以获得良好的连接器特性。