InSn-50Ag composite solder joints doping Ni-coated carbon nanotubes (Ni-CNTs) were fabricated by transient liquid phase (TLP) bonding, and then the effect of Ni-CNTs contents (x = 0, 0.01, 0.03, 0.05, 0.07, 0.1 wt%) on the microstructure and shear property of the composite solder joints was examined. The results showed that the microstructure of Cu/InSn-50Ag-x(Ni-CNTs)/Cu composite solder joints consisted of the interfacial region bamboo-type Cu₃(In, Sn), solder center region Ag₃In, Ni₃Sn₄, Ag particles and Ni-CNTs. The appropriate amounts of Ni-CNTs (about 0.07 wt%) are conducive to form a compact composite solder joint and restrain the growth of interfacial Cu₃(In, Sn) IMC layer, and the morphologies of IMC layer are determined by Ni-CNTs suppressing atom diffusion and IMC grain orientation. The shear strength of composite solder joints relates to Ni-CNTs content, and the maximum shear strength reaches 42 MPa of Cu/InSn-50Ag-0.07(Ni-CNTs)/Cu. It is regulated by uniform distribution of Ni-CNTs, refined Ag₃In grains and interface IMC layer with near-continuous voids. The fracture of the composite solder joints doped Ni-CNTs occurred near to the boundary between the interfacial IMC layer and solder center region, the fracture mechanism is ductile fracture.

InSn-50Ag 复合焊点掺杂 Ni 包覆碳纳米管 (Ni-CNTs) 通过瞬态液相 (TLP) 键合制备，然后 Ni-CNTs 含量的影响 ( x  = 0, 0.01, 0.03, 0.05, 0.07, 0.1 wt%) 对复合焊点的微观结构和剪切性能进行了检查。结果表明,Cu/InSn-50Ag- x (Ni-CNTs)/Cu复合焊点的微观结构由界面区竹状Cu ₃ (In, Sn)、焊料中心区Ag ₃ In、Ni ₃ Sn组成。₄、Ag颗粒和Ni-CNT。适量的 Ni-CNTs（约 0.07 wt%）有利于形成致密的复合焊点并抑制界面 Cu ₃的生长(In, Sn) IMC 层和 IMC 层的形貌由 Ni-CNTs 抑制原子扩散和 IMC 晶粒取向决定。复合焊点的剪切强度与Ni-CNTs的含量有关，Cu/InSn-50Ag-0.07(Ni-CNTs)/Cu的最大剪切强度达到42 MPa。它受 Ni-CNT 的均匀分布、细化的 Ag ₃ In 晶粒和具有近乎连续空隙的界面 IMC 层的调节。掺杂Ni-CNTs的复合焊点的断裂发生在界面IMC层与焊料中心区域的边界附近，断裂机制为韧性断裂。