Purpose

The purpose of this paper is to develop a new composite solder to improve the reliability of composite solder joints. Nano-particles modified multi-walled carbon nanotubes (Ni-MWCNTs) can indeed improve the microstructure of composite solder joints and improve the reliability of solder joints. Although many people have conducted in-depth research on the composite solder of Ni-MWCNTs. However, no one has studied the performance of Ni-MWCNTs composite solder under different aging conditions. In this article, Ni-MWCNTs was added to Sn-Ag-Cu (SAC) solder, and the physical properties of composite solder, the microstructure and mechanical properties were evaluated.

Design/methodology/approach

In this study, the effect of different aging conditions on the intermetallic compound (IMC) layer growth and shear strength of Ni-modified MWCNTs reinforced SAC composite solder was studied. Compared with SAC307 solder alloy, the influence of Ni-MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on composite solder was examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 80°C, 120°C and 150°C.

Findings

The experimental results show that the content of Ni-MWCNTs affects the morphology and growth of the IMC layer at the interface. The microhardness of the solder increases and the wetting angle decreases. After aging at moderate (120°C) and high temperature (150°C), the morphology of the Cu6Sn5 IMC layer changed from scallop to lamellar and the grain size became coarser. The following two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu3Sn and (Cu, Ni)6Sn5. The fracture surface of the solder joints all appeared ductile dents, and the size of the pits increased significantly with the increase of the aging temperature. Through growth kinetic analysis, Ni-modified MWCNTs in composite solder joints can effectively inhibit the diffusion of atoms in solder joints. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the highest shear strength.

Originality/value

In this study, the effects of aging conditions on the growth and shear strength of the IMC layer of Ni modified MWCNTs reinforced SAC307 composite solder were studied. The effects of Ni MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on the composite solder were examined.

中文翻译：

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不同时效条件对Ni改性MWCNTs增强Sn-Ag-Cu复合焊料IMC层生长和剪切强度的影响

目的

本文的目的是开发一种新的复合焊料，以提高复合焊点的可靠性。纳米粒子改性多壁碳纳米管（Ni-MWCNTs）确实可以改善复合焊点的微观结构，提高焊点的可靠性。虽然很多人对Ni-MWCNTs的复合焊料进行了深入的研究。然而，没有人研究过Ni-MWCNTs复合焊料在不同老化条件下的性能。本文将Ni-MWCNTs添加到Sn-Ag-Cu（SAC）焊料中，对复合焊料的物理性能、微观结构和力学性能进行了评价。

设计/方法/方法

本研究研究了不同时效条件对 Ni 改性 MWCNTs 增强 SAC 复合焊料的金属间化合物 (IMC) 层生长和剪切强度的影响。与 SAC307 焊料合金相比，考察了不同含量（0、0.1 和 0.2 Wt.%）的 Ni-MWCNTs 对复合焊料的影响。为了研究复合焊点的老化特性，焊点在 80°C、120°C 和 150°C 下进行了老化。

发现

实验结果表明，Ni-MWCNTs的含量影响界面处IMC层的形貌和生长。焊料的显微硬度增加，润湿角减小。在中温（120℃）和高温（150℃）时效后，Cu6Sn5 IMC层的形貌由扇形变为层状，晶粒尺寸变粗。在 Ni-MWCNTs 增强的焊点中观察到以下两种不同的相组成：Cu3Sn 和 (Cu, Ni)6Sn5。焊点断口处均出现延展性压痕，且凹坑尺寸随着时效温度的升高而显着增大。通过生长动力学分析，复合焊点中的Ni改性多壁碳纳米管可以有效抑制焊点中原子的扩散。简而言之，

原创性/价值

本研究研究了时效条件对Ni改性MWCNTs增强SAC307复合焊料IMC层生长和剪切强度的影响。研究了不同含量（0、0.1 和 0.2 Wt.%）的 Ni MWCNTs 对复合焊料的影响。