The excellent performance of semiconductor products is guaranteed by high-precision surface mount technology (SMT). In the process of chip mounting, the high speed and high precision are two important performance indicators. However, the high-speed and high-acceleration motion can easily lead to the mechanical residual vibration, which increases the adjustment time and even reduces the chip mounting precision. Thus, high speed and high precision are contradictory and difficult to realize at the same time. In the premise of ensuring the accuracy, a novel real-time motion control method based on the S-shaped velocity planning with optimal efficiency is proposed, which avoids the increase in the adjustment time of the ending point overshoot while improving the operating velocity of point-to-point. Firstly, the velocity feasible regions are determined under the kinematical constraints of the linear motor. Secondly, the acceleration or deceleration time series of the S-shaped velocity curve are calculated based on the constrains of boundary velocities. And then the time distribution of S-shaped velocity curve is updated with the goal of optimal efficiency under the small displacement constraints from point to point. Finally, the point-to-point real-time motion control is realized based on the S-shaped velocity planning algorithm. The correctness and effectiveness of the proposed method for chip mounting efficiency and precision are verified by simulation and experiment. And the experimental results show that the motion planning algorithm based on the S-shaped velocity planning can control the running velocity accurately in real time and improve the motion efficiency while ensuring the precision and stability.

高精度表面贴装技术（SMT）保证了半导体产品的卓越性能。在贴片过程中，高速和高精度是两个重要的性能指标。但高速、高加速度运动容易产生机械残余振动，增加调整时间，甚至降低贴片精度。因此，高速和高精度是矛盾的，难以同时实现。在保证精度的前提下，提出了一种新的基于S形速度规划、效率最优的实时运动控制方法，在提高点的运行速度的同时，避免了终点超调调整时间的增加。 -点。首先，速度可行区域是在线性电机的运动学约束下确定的。其次，基于边界速度的约束计算S形速度曲线的加速或减速时间序列。然后以小位移约束下的最优效率为目标，逐点更新S形速度曲线的时间分布。最后，基于S形速度规划算法实现点对点实时运动控制。通过仿真和实验验证了所提方法对芯片贴装效率和精度的正确性和有效性。