Purpose

The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the microstructure, shear strength, electrical property, thermal conductivity and aging property of the composite joint were investigated.

Design/methodology/approach

The composite joint was made of microporous copper and Cu₃Sn. Microporous copper was immersed into liquid Sn to achieve Sn-microporous copper composite structure for die attachment. By the thermo-compression bonding, the Cu₃Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained after bonding at 350 °C for 5 min under a low pressure of 0.6 MPa.

Findings

After thermo-compression bonding, the resulting interconnection could withstand a high temperature of at most 676 °C, with the entire Sn transforming into Cu₃Sn with high remelting temperatures. A large shear strength could be achieved with the Cu₃Sn-microporous copper in the interconnections. The formed bondlines demonstrated a good electrical and thermal conductivity owing to the large existing amount of copper in the interconnections. Furthermore, the interconnection also exhibited excellent reliability under high temperature aging at 300 °C.

Originality/value

This die-attach composite joint was suitable for power devices operating under high temperatures or other harsh environments.

中文翻译：

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用于高温芯片贴装应用的 Cu3Sn-微孔铜复合接头

目的

本文的目的是设计一种基于瞬态液相键合的用于高温芯片贴装应用的新型芯片贴装复合接头。此外，还对复合接头的显微组织、剪切强度、电性能、导热性能和老化性能进行了研究。

设计/方法/方法

复合接头由微孔铜和Cu ₃ Sn制成。将微孔铜浸入液态锡中，获得用于芯片附着的锡-微孔铜复合结构。通过热压结合，在350 ℃、0.6 MPa的低压下结合5 min，成功获得厚度为100 µm的Cu _{3 Sn-微孔铜复合接头。}

发现

热压结合后，所得互连可以承受最高676°C的高温，整个Sn转变为具有高重熔温度的Cu _{3 Sn。互连中的Cu 3} Sn-微孔铜可以实现大的剪切强度。由于互连中存在大量铜，所形成的粘合线表现出良好的导电性和导热性。此外，互连在 300°C 的高温老化下也表现出优异的可靠性。

原创性/价值

这种芯片连接复合接头适用于在高温或其他恶劣环境下运行的功率器件。