MXenes are a growing family of two-dimensional transition metal carbides and/or nitrides that are densely stacked into macroscopically layered films and have been considered for applications such as flexible electromagnetic interference (EMI) shielding materials. However, the mechanical and electrical reliabilities of titanium carbide MXene films are affected by voids in their structure. We applied sequential bridging of hydrogen and covalent bonding agents to induce the densification of MXene films and removal of the voids, leading to highly compact MXene films. The obtained MXene films show high tensile strength, in combination with high toughness, electrical conductivity, and EMI shielding capability. Our high-performance MXene films are scalable, providing an avenue for assembling other two-dimensional platelets into high-performance films.

中文翻译：

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通过桥接诱导致密化的高强度可扩展 MXene 薄膜

MXene 是越来越多的二维过渡金属碳化物和/或氮化物家族，它们密集堆叠成宏观层状薄膜，并已被考虑用于柔性电磁干扰 (EMI) 屏蔽材料等应用。然而，碳化钛 MXene 薄膜的机械和电气可靠性受到其结构中的空隙的影响。我们应用氢和共价键合剂的顺序桥接来诱导 MXene 薄膜的致密化和空隙的去除，从而产生高度紧凑的 MXene 薄膜。获得的 MXene 薄膜显示出高拉伸强度，以及高韧性、导电性和 EMI 屏蔽能力。我们的高性能 MXene 薄膜具有可扩展性，为将其他二维薄片组装成高性能薄膜提供了途径。