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High-speed 2D and 3D mid-IR imaging with an InGaAs camera
APL Photonics ( IF 5.4 ) Pub Date : 2021-09-22 , DOI: 10.1063/5.0061661
Eric O Potma 1 , David Knez 1 , Martin Ettenberg 2 , Matthew Wizeman 2 , Hai Nguyen 2 , Tom Sudol 2 , Dmitry A Fishman 1
Affiliation  

Recent work on mid-infrared (MIR) detection through the process of non-degenerate two-photon absorption (NTA) in semiconducting materials has shown that wide-field MIR imaging can be achieved with standard Si cameras. While this approach enables MIR imaging at high pixel densities, the low nonlinear absorption coefficient of Si prevents fast NTA-based imaging at lower illumination doses. Here, we overcome this limitation by using InGaAs as the photosensor. Taking advantage of the much higher nonlinear absorption coefficient of this direct bandgap semiconductor, we demonstrate high-speed MIR imaging up to 500 fps with under 1 ms exposure per frame, enabling 2D or 3D mapping without pre- or post-processing of the image.

中文翻译:

使用 InGaAs 相机进行高速 2D 和 3D 中红外成像

最近通过半导体材料中的非退化双光子吸收 (NTA) 过程进行中红外 (MIR) 检测的工作表明,使用标准硅相机可以实现宽视场 MIR 成像。虽然这种方法能够在高像素密度下实现 MIR 成像,但 Si 的低非线性吸收系数阻碍了在较低照明剂量下基于 NTA 的快速成像。在这里,我们通过使用 InGaAs 作为光电传感器克服了这一限制。利用这种直接带隙半导体的高得多的非线性吸收系数,我们展示了高达 500 fps 的高速 MIR 成像,每帧曝光时间不到 1 毫秒,无需对图像进行预处理或后处理即可实现 2D 或 3D 映射。
更新日期:2021-09-30
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