The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.

中文翻译：

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通过转移印刷在单个芯片上将多种材料的微米级器件空间密集集成

使用转移印刷 (TP) 技术演示了将多种材料平台的设备异构集成到单个芯片上。以空间密集排列的设备串行打印要求后续过程不干扰先前打印的组件，即使在打印头与这些设备接触的情况下也是如此。在本手稿中，我们展示了器件尺寸数量级的封装内组件的确定性集成，包括集成到单个芯片上的 AlGaAs、金刚石和 GaN 波导谐振器。使用 GaAs/AlGaAs 和 InP 激光器的半导体纳米线 (NW) 的串行集成也通过 1 μ m 范围内的器件到器件间距进行了演示。