While photonic integration has made remarkable progress in recent years, there is no one integrated photonic platform that offers all desired functionalities and manufacturability on the same platform. GaAs and InP-based optoelectronic integrated circuits (OEICs) were very popular in the past decades; however, silicon photonics has recently emerged as a preferred platform due to its high-density and high-yield manufacturability leveraging the CMOS ecosystem, although it lacks optical gain, the Pockels effect, and other characteristics. On the other hand, hybrid photonic integration adds new and diverse functionalities to the host materials like silicon. This opinion paper investigates hybrid integrated photonic platforms, and discusses the new functionalities added to the silicon CMOS photonic platform.

中文翻译：

---

混合集成光子平台：意见

尽管近年来光子集成取得了显着进展，但没有一个集成光子平台可以在同一平台上提供所有所需的功能和可制造性。GaAs 和 InP 基光电集成电路 (OEIC) 在过去几十年中非常流行；然而，硅光子学最近因其利用 CMOS 生态系统的高密度和高产量可制造性而成为首选平台，尽管它缺乏光学增益、普克尔斯效应和其他特性。另一方面，混合光子集成为硅等主体材料增加了新的和多样化的功能。本意见书研究了混合集成光子平台，并讨论了添加到硅 CMOS 光子平台的新功能。