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Tuning Conjugated Polymer Chain Packing for Stretchable Semiconductors
Advanced Materials ( IF 29.4 ) Pub Date : 2021-09-24 , DOI: 10.1002/adma.202104747
Jie Xu 1, 2 , Hung-Chin Wu 1 , Jaewan Mun 1 , Rui Ning 1 , Weichen Wang 1 , Ging-Ji Nathan Wang 1, 3 , Shayla Nikzad 1 , Hongping Yan 1, 4 , Xiaodan Gu 1, 4 , Shaochuan Luo 5 , Dongshan Zhou 5 , Jeffrey B-H Tok 1 , Zhenan Bao 1
Affiliation  

In order to apply polymer semiconductors to stretchable electronics, they need to be easily deformed under strain without being damaged. A small number of conjugated polymers, typically with semicrystalline packing structures, have been reported to exhibit mechanical stretchability. Herein, a method is reported to modify polymer semiconductor packing-structure using a molecular additive, dioctyl phthalate (DOP), which is found to act as a molecular spacer, to be inserted between the amorphous chain networks and disrupt the crystalline packing. As a result, large-crystal growth is suppressed while short-range aggregations of conjugated polymers are promoted, which leads to an improved mechanical stretchability without affecting charge-carrier transport. Due to the reduced conjugated polymer intermolecular interactions, strain-induced chain alignment and crystallization are observed. By adding DOP to a well-known conjugated polymer, poly[2,5-bis(4-decyltetradecyl)pyrrolo[3,4-c]pyrrole-1,4-(2H,5H)-dione-(E)-1,2-di(2,2′-bithiophen-5-yl)ethene] (DPPTVT), stretchable transistors are obtained with anisotropic charge-carrier mobilities under strain, and stable current output under strain up to 100%.

中文翻译:

调整可拉伸半导体的共轭聚合物链填料

为了将聚合物半导体应用于可拉伸电子产品,它们需要在应变下容易变形而不会损坏。据报道,少数共轭聚合物(通常具有半结晶堆积结构)表现出机械拉伸性。本文报道了一种使用分子添加剂邻苯二甲酸二辛酯 (DOP) 修饰聚合物半导体填充结构的方法,该分子添加剂被发现充当分子间隔物,插入无定形链网络之间并破坏结晶填充。结果,抑制了大晶体的生长,同时促进了共轭聚合物的短程聚集,从而在不影响电荷载流子传输的情况下提高了机械拉伸性。由于共轭聚合物分子间相互作用降低,观察到应变诱导的链排列和结晶。通过将 DOP 添加到众所周知的共轭聚合物中,聚[2,5-双(4-癸基十四烷基)吡咯并[3,4-c]吡咯-1,4-(2H ,5 H )-dione-(E)-1,2-di(2,2'-bithiophen-5-yl)ethene] (DPPTVT),获得了在应变下具有各向异性电荷载流子迁移率的可拉伸晶体管,并且稳定应变下的电流输出高达 100%。
更新日期:2021-09-24
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