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Improved thermal conductivity and breakdown strength of PVDF-based composites by improving the dispersion of BN
High Voltage ( IF 4.4 ) Pub Date : 2021-09-22 , DOI: 10.1049/hve2.12150
Yanxin Li 1 , Zhuo Wang 1 , Menglei Kong 1 , Zhihui Yi 1
Affiliation  

In order to adapt to the development of electronic devices, it is necessary to improve the thermal conductivity and breakdown strength of composites. Boron nitride (BN) is an ideal candidate material with high breakdown strength and thermal conductivity. Therefore, the introduction of BN nanosheets into the polyvinylidene fluoride (PVDF) matrix can improve the thermal conductivity and breakdown strength of the composites at the same time. However, BN nanosheets can easily agglomerate in the matrix, which limits the improvement of the properties of the composites. To overcome this difficulty, appropriate water-bath heating was used to improve the fluidity of PVDF. Therefore, the dispersion of the filler is improved. When the volume fraction of BN nanosheets is 3% and the preparation temperature is 45°C, the energy storage density of the composites reached 18.5 J/cm3 at 540 kV/mm. At this point, the thermal conductivity was 0.49 W/(m⋅K), 3.5 times that of the pure PVDF film.

中文翻译:

通过改善 BN 的分散性来提高 PVDF 基复合材料的热导率和击穿强度

为了适应电子器件的发展,需要提高复合材料的热导率和击穿强度。氮化硼(BN)是一种理想的候选材料,具有高击穿强度和导热性。因此,在聚偏二氟乙烯(PVDF)基体中引入BN纳米片可以同时提高复合材料的热导率和击穿强度。然而,BN纳米片很容易在基体中团聚,这限制了复合材料性能的提高。为了克服这一困难,采用适当的水浴加热来提高 PVDF 的流动性。因此,改善了填料的分散。当BN纳米片的体积分数为3%,制备温度为45℃时,3在 540 kV/mm 时。此时的热导率为0.49 W/(m·K),是纯PVDF薄膜的3.5倍。
更新日期:2021-09-22
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