当前位置：
X-MOL 学术
›
Dalton Trans.
›
论文详情
Our official English website, www.x-mol.net, welcomes your
feedback! (Note: you will need to create a separate account there.)
Encapsulating third donors into D–A hybrid heterostructures to form three-component charge-transfer complexes for enhanced electrical properties
Dalton Transactions ( IF 3.5 ) Pub Date : 2021-08-31 , DOI: 10.1039/d1dt02230j Meng-Hua Li 1 , Ming-Hua You 2 , Mei-Jin Lin 1, 3
Dalton Transactions ( IF 3.5 ) Pub Date : 2021-08-31 , DOI: 10.1039/d1dt02230j Meng-Hua Li 1 , Ming-Hua You 2 , Mei-Jin Lin 1, 3
Affiliation
|
D–A hybrid heterostructures are an emerging class of crystalline hybrid materials composed of semiconductive inorganic donors and organic acceptors. However, due to the steric effects of the inorganic coordination sites, it is difficult for the large organic molecules to form compact packing at the molecular level, resulting in the poor efficiency of photoinduced charge transfers. To achieve an effective carrier separation and transfer, herein we incorporated third donors into a copper(I) halide/thiazolo[5,4-d] thiazole D–A heterostructure to construct three novel three-component complexes (Me2-Py2TTz)Cu4I6·(I2) (1), (Me2-Py2TTz)Cu3I5·(pyrene) (2) and (Me2-Py2TTz)Cu3I5·(perylene) (3) (Py2TTz = 2,5-bis(4-pyridyl) thiazolo[5,4-d] thiazole), respectively. Due to the spatial distances as well as the orbital energies between the copper(I) halide and thiazolo[5,4-d] thiazole units bridged by third donors, they are excellent three-component charge-transfer complexes (CTCs) with enhanced electrical properties.
中文翻译：
将第三个供体封装到 D-A 混合异质结构中以形成三组分电荷转移复合物以增强电性能
D-A 杂化异质结构是一类新兴的晶体杂化材料，由半导体无机给体和有机受体组成。然而，由于无机配位点的空间效应，有机大分子难以在分子水平上形成紧密堆积，导致光致电荷转移效率低下。为了实现有效的载体分离和转移，本文将第三个供体结合到铜（I）卤化物/噻唑并[5,4 - d ]噻唑 D-A 异质结构中，以构建三种新型三组分配合物（Me 2 -Py 2 TTz )Cu 4 I 6 ·(I 2 ) ( 1 ), (Me2 -Py 2 TTz)Cu 3 I 5 ·(芘) ( 2 ) 和 (Me 2 -Py 2 TTz)Cu 3 I 5 ·(苝) ( 3 ) (Py 2 TTz = 2,5-bis(4-吡啶基)噻唑并[5,4- d ]噻唑)，分别。由于铜（ I）卤化物和由第三供体桥接的噻唑并[5,4- d ]噻唑单元之间的空间距离以及轨道能量，它们是优异的三组分电荷转移复合物（CTC），具有增强的电特性。
更新日期：2021-09-17
中文翻译：
将第三个供体封装到 D-A 混合异质结构中以形成三组分电荷转移复合物以增强电性能
D-A 杂化异质结构是一类新兴的晶体杂化材料，由半导体无机给体和有机受体组成。然而，由于无机配位点的空间效应，有机大分子难以在分子水平上形成紧密堆积，导致光致电荷转移效率低下。为了实现有效的载体分离和转移，本文将第三个供体结合到铜（I）卤化物/噻唑并[5,4 - d ]噻唑 D-A 异质结构中，以构建三种新型三组分配合物（Me 2 -Py 2 TTz )Cu 4 I 6 ·(I 2 ) ( 1 ), (Me2 -Py 2 TTz)Cu 3 I 5 ·(芘) ( 2 ) 和 (Me 2 -Py 2 TTz)Cu 3 I 5 ·(苝) ( 3 ) (Py 2 TTz = 2,5-bis(4-吡啶基)噻唑并[5,4- d ]噻唑)，分别。由于铜（ I）卤化物和由第三供体桥接的噻唑并[5,4- d ]噻唑单元之间的空间距离以及轨道能量，它们是优异的三组分电荷转移复合物（CTC），具有增强的电特性。
京公网安备 11010802027423号