A Modulation QCM Applied to Copper Electrodeposition and Stripping,Electroanalysis

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A Modulation QCM Applied to Copper Electrodeposition and Stripping
Electroanalysis ( IF 2.7 ) Pub Date : 2021-09-16 , DOI: 10.1002/elan.202100471
Christian Leppin ₁ , Arne Langhoff ₁ , Oliver Höfft ₁ , Diethelm Johannsmann ₂

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A fast electrochemical quartz crystal microbalance with dissipation monitoring (EQCM−D) was applied to copper electrodeposition and subsequent stripping. Accumulation brings the frequency noise down to the mHz range, corresponding to 0.1 % of a monolayer. With this precision, the apparent mass transfer rate as determined from the time-derivative of the frequency shift can be directly compared to the current. Small but systematic deviations between the two can be attributed to nanoscale roughness. In the voltage range of underpotential deposition (UPD), the apparent mass transfer rate shows peaks and shoulders. The plating additive benzotriazole (BTA) leaves the magnitude of electrogravimetric signals unchanged, but shifts the UPD onset potential. The additive thiourea (TU) promotes UPD and strongly increases the bandwidth.

中文翻译：

一种应用于铜电沉积剥除的调制QCM

将具有耗散监测功能的快速电化学石英晶体微量天平 (EQCM-D) 应用于铜电沉积和随后的剥离。累积将频率噪声降低到 mHz 范围，相当于单层的 0.1%。有了这种精度，根据频移的时间导数确定的表观传质速率可以直接与电流进行比较。两者之间微小但系统的偏差可归因于纳米级粗糙度。在欠电位沉积 (UPD) 的电压范围内，表观传质速率显示出峰和肩。电镀添加剂苯并三唑 (BTA) 使电重信号的幅度保持不变，但会改变 UPD 起始电位。添加剂硫脲 (TU) 可促进 UPD 并显着增加带宽。

更新日期：2021-09-16

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