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A Micromachined Resonant Low-Pressure Sensor With High Quality Factor
IEEE Sensors Journal ( IF 4.3 ) Pub Date : 2021-07-12 , DOI: 10.1109/jsen.2021.3096544
Yu Zheng , Sen Zhang , Deyong Chen , Junbo Wang , Jian Chen

This article presents a micromachined resonant low-pressure sensor with high quality factor. In this sensor, an island-diaphragm structure was developed, translating low pressures under measurements to frequency shifts of resonators, and improving quality factors of resonators by eliminating modal interferences between resonators and the pressure-sensitive diaphragm. Numerical simulations were conducted, confirming that the developed resonant low-pressure sensor can work properly in the measurement range without modal interference due to the island-diaphragm structure. The fabrication process of the developed resonant low-pressure sensor including key steps of deep reactive ion etching, resonator release and anodic bonding was conducted in this study. Experimental characterization showed high quality factors of resonators (>30000), which were significantly better than previous study (<10000). Moreover, low fitting errors (within ±2 Pa), low hysteresis (within ±2 Pa) and high accuracies (measurement errors within ±2 Pa) were also characterized in the low pressure range of 0.1 kPa-1 kPa and the temperature range of −40 °C–60 °C, validating the high performances of the developed resonant low-pressure sensor.

中文翻译:


具有高品质因数的微机械谐振低压传感器



本文介绍了一种具有高品质因数的微机械谐振低压传感器。在该传感器中,开发了岛膜片结构,将测量下的低压转化为谐振器的频移,并通过消除谐振器和压敏膜片之间的模态干扰来提高谐振器的品质因数。进行了数值模拟,证实所开发的谐振低压传感器能够在测量范围内正常工作,并且不会由于岛膜片结构而产生模态干扰。本研究进行了所开发的谐振低压传感器的制造过程,包括深度反应离子蚀刻、谐振器释放和阳极键合的关键步骤。实验表征显示谐振器的品质因数较高 (>30000),明显优于之前的研究 (<10000)。此外,在0.1kPa-1kPa的低压范围和200℃的温度范围内,还具有低拟合误差(±2Pa以内)、低滞后(±2Pa以内)和高精度(测量误差在±2Pa以内)的特点。 −40 °C–60 °C,验证了所开发的谐振低压传感器的高性能。
更新日期:2021-07-12
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