This paper presents a resonant differential-pressure (DP) microsensor with temperature (T) and static-pressure (SP) compensations. In this microsensor, three resonators were positioned on and beside the pressure-sensitive diaphragm and the corresponding intrinsic frequencies were translated into differential pressure under the interferences of temperature and static pressure. Finite element simulation was conducted for device modeling, locating the relationship between the intrinsic resonant frequencies of three resonators and values of differential pressure, temperature and static pressure. Microfabrication (e.g., photolithography, deep reactive-ion etching and anodic bonding) was employed to manufacture the microsensor with key fabrication results displayed in this study. Experimental characterizations were conducted, which indicated that the maximum fitting error of the fabricated microsensor was deceased from 2145.7 Pa (before compensation) to 98.2 Pa (after compensation) under a differential-pressure range from 0 kPa to 100 kPa, a temperature range from 10 °C to 60 °C and a static-pressure range from 110 kPa to 200 kPa.

中文翻译：

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一种具有温度和静压补偿的谐振压差微传感器

本文介绍了一种具有温度 (T) 和静压 (SP) 补偿的谐振压差 (DP) 微传感器。在这个微型传感器中，三个谐振器位于压敏膜片上和旁边，相应的固有频率在温度和静压的干扰下转化为压差。对器件建模进行了有限元仿真，定位了三个谐振器的固有谐振频率与压差、温度和静压值之间的关系。微制造（例如，光刻、深反应离子蚀刻和阳极键合）用于制造微传感器，本研究中显示了关键制造结果。进行了实验表征，