Role of Interfaces in the Thermal Reduction Process of the FeO/Cu2O/Cu(100) Surface,The Journal of Physical Chemistry C

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Role of Interfaces in the Thermal Reduction Process of the FeO/Cu2O/Cu(100) Surface
The Journal of Physical Chemistry C ( IF 3.3 ) Pub Date : 2021-09-15 , DOI: 10.1021/acs.jpcc.1c05527
Guihang Li ₁ , Xin Yu _{2,

3,

4} , C. J. Weststrate ₅ , Pengju Ren _{2,

3} , Jian Xu _{2,

4} , Qian Xu ₁ , Yong Yang _{2,

3,

4} , Yongwang Li _{2,

3,

4} , J. W. Niemantsverdriet _{4,

5} , Xiaodong Wen _{2,

3,

4} , Junfa Zhu ₁

Affiliation

FeO(111) islands grown on the Cu(100) substrate forming the FeO/Cu₂O/Cu(100) model surface and oxygen-covered Cu(100) (Cu₂O/Cu(100)) have been prepared and characterized by scanning tunneling microscopy (STM), synchrotron radiation photoemission spectroscopy (SRPES), and low-energy electron diffraction (LEED). Annealing the FeO/Cu₂O/Cu(100) and Cu₂O/Cu(100) surfaces shows distinct differences in thermal stability. As compared to the pure Cu₂O/Cu(100) surface, both STM and SRPES results indicate that the presence of FeO islands promotes the reduction of the oxygen-covered copper surface upon annealing. The absence of O₂ signals in temperature-programmed desorption (TPD) experiments suggests that the oxygen adatoms diffuse into the copper bulk upon annealing up to 800 K and may react with segregated carbon atoms from bulk at temperatures higher than 800 K. Combining all these results, we conclude that the interface plays an important role in the properties of hybrid surface structures, and the obtained FeO/Cu₂O/Cu(100) and Cu₂O/Cu(100) surfaces may be used as model systems for studying the Cu–Fe-based catalysts.

中文翻译：

界面在 FeO/Cu2O/Cu(100) 表面热还原过程中的作用

已经制备并表征了在形成 FeO/Cu ₂ O/Cu(100) 模型表面的 Cu(100) 衬底上生长的 FeO(111) 岛和氧覆盖的 Cu(100) (Cu ₂ O/Cu(100))通过扫描隧道显微镜 (STM)、同步辐射光电子能谱 (SRPES) 和低能电子衍射 (LEED)。对 FeO/Cu ₂ O/Cu(100) 和 Cu ₂ O/Cu(100) 表面进行退火显示出热稳定性的明显差异。与纯 Cu ₂ O/Cu(100) 表面相比，STM 和 SRPES 结果均表明 FeO 岛的存在促进了退火时氧覆盖的铜表面的还原。O ₂的缺失程序升温脱附 (TPD) 实验中的信号表明，氧吸附原子在退火至 800 K 时扩散到铜体中，并可能在高于 800 K 的温度下与体中分离的碳原子反应。结合所有这些结果，我们得出结论界面对混合表面结构的性质起着重要作用，获得的 FeO/Cu ₂ O/Cu(100) 和 Cu ₂ O/Cu(100) 表面可作为研究 Cu-Fe-基催化剂。

更新日期：2021-09-30

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