With the increasing thermal challenges of electronic equipment, topology optimization of heat sinks has aroused great research interest in recent years. However, most related researches deal with heat transfer problems of the laminar flow. Only several papers deal with heat transfer problems of the turbulent flow which exhibits better heat dissipation capacity. This paper intends to demonstrate the topology optimization of turbulent forced convective heat sinks with a computational-cheap multi-layer thermofluid model. Based on the assumption of a hydrodynamically fully developed turbulent flow, a single-layer flow model is derived from the 3D turbulent flow model. Viscous effects in the out-of-plane direction are modeled as the additional terms in the derived momentum and transportation equations. Similarly, based on the assumption of adaptive temperature profiles in the out-of-plane direction, heat fluxes between adjacent layers are modeled and a multi-layer heat transfer model is constructed. Further, the porosity field is introduced to describe the channel’s topology and the corresponding topology optimization scheme is presented. Topology optimizations of a heat sink for coil-cooling are carried out to reduce the average temperature rise of the heat source under a maximum volume fraction constraint. The accuracy of the multi-layer model is evaluated via 3D thermofluid simulation of optimized and reference designs. Topology-optimized heat sinks exhibit better thermal performance and provide up to a 32.39% reduction of the average temperature rise, compared with the reference designs. Additionally, a comparative study is also provided between designs optimized in heat transfer problems under laminar and turbulent flows.

随着电子设备的热挑战日益增加，散热器的拓扑优化近年来引起了人们极大的研究兴趣。然而，大多数相关研究涉及层流的传热问题。只有几篇论文讨论了具有更好散热能力的湍流的传热问题。本文旨在用计算成本低的多层热流体模型演示湍流强制对流散热器的拓扑优化。基于流体动力学充分发展的湍流的假设，从 3D 湍流模型推导出单层流模型。平面外方向的粘性效应被建模为导出的动量和传输方程中的附加项。相似地，基于面外方向的自适应温度分布假设，对相邻层之间的热通量进行建模，并构建多层传热模型。此外，引入孔隙度场来描述通道的拓扑结构，并提出相应的拓扑优化方案。对用于盘管冷却的散热器进行拓扑优化，以在最大体积分数约束下降低热源的平均温升。多层模型的准确性通过优化设计和参考设计的 3D 热流体模拟进行评估。与参考设计相比，拓扑优化的散热器具有更好的热性能，平均温升最多可降低 32.39%。此外，