Within the scope of the study, the thermal conductivity (TC) and thermal diffusivity (TD) of hexagonal boron nitride (h-BN) and reduced graphene (r-GO)-based epoxy nanocomposites were investigated and compared. In addition, the dielectric properties and electrical conductivity of the two were also investigated. The heat transport phenomenon of h-BN/epoxy and r-GO/epoxy nanocomposites were investigated using the transient plane source (HOT DISK) technique at room temperature. The h-BN/epoxy nanocomposites exhibited a higher thermal transport than the r-GO/epoxy nanocomposites. A high TC of ~ 2.6 W/mK and a high TD of ~ 9 mm²/s were observed at a h-BN loading of 2 vol% in the nanocomposite. The TC and TD values were ~ 33% and ~ 119% higher than r-GO/epoxy nanocomposite. The relative dielectric permittivity \({(\varepsilon }_{r})\) and loss (δ) was observed to be higher for r-GO/epoxy nanocomposite when compared to h-BN/epoxy nanocomposites. High relative dielectric permittivity of ~ 7.5 and loss of ~ 0.07 was obtained at a r-GO loading of ~ 2.2 vol% in the nanocomposite. Further, both nanocomposites retained a high electrical resistance. The study indicates h-BN/epoxy nanocomposite to hold significant potential for heat management in electronic applications.

在研究范围内，研究并比较了六方氮化硼 (h-BN) 和还原石墨烯 (r-GO) 基环氧纳米复合材料的热导率 (TC) 和热扩散率 (TD)。此外，还研究了两者的介电性能和电导率。使用瞬态平面源（HOT DISK）技术在室温下研究了 h-BN/环氧树脂和 r-GO/环氧树脂纳米复合材料的热传输现象。h-BN/环氧树脂纳米复合材料表现出比 r-GO/环氧树脂纳米复合材料更高的热传输。在纳米复合材料中 h-BN 负载量为 2 vol% 时，观察到~ 2.6 W/mK 的高 TC 和 ~ 9 mm ² /s的高 TD 。TC 和 TD 值比 r-GO/环氧树脂纳米复合材料高约 33% 和约 119%。相对介电常数与 h-BN/环氧树脂纳米复合材料相比，r-GO/环氧树脂纳米复合材料的\({(\varepsilon }_{r})\)和损失 ( δ ) 更高。在纳米复合材料中以~2.2 vol% 的 r-GO 负载量获得~7.5 的高相对介电常数和~0.07 的损耗。此外，两种纳米复合材料都保持高电阻。该研究表明 h-BN/环氧树脂纳米复合材料在电子应用中的热管理方面具有巨大的潜力。