The recent researches have shown that adding an appropriate amount of foreign reinforcements to lead-free solders can improve their wettablity, reduce their melting points, optimize their microstructure, and reinforce their mechanical properties. Moreover, it also inhibits the coarsening and growth of intermetallic compounds (IMC) and matrix microstructure under aging conditions such as high temperature aging or current stressing. However, there are still many limitations in the preparation and practical application of composite lead-free solders. By reviewing the existing research results, this paper summarizes the main problems in the preparation and applications of composite solder and analyzes the future research directions of this field.

最近的研究表明，在无铅焊料中加入适量的外来增强剂可以提高其润湿性，降低其熔点，优化其微观结构，增强其机械性能。此外，它还抑制了高温时效或电流应力等时效条件下金属间化合物（IMC）和基体微观结构的粗化和生长。然而，复合无铅焊料的制备和实际应用还存在诸多限制。本文通过对现有研究成果的回顾，总结了复合焊料制备和应用中存在的主要问题，并分析了该领域未来的研究方向。