3D Printing Conductive Composites with Poly(ionic liquid) as a Noncovalent Intermedia to Fabricate Carbon Circuits,Macromolecular Materials and Engineering

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3D Printing Conductive Composites with Poly(ionic liquid) as a Noncovalent Intermedia to Fabricate Carbon Circuits
Macromolecular Materials and Engineering ( IF 4.2 ) Pub Date : 2021-09-14 , DOI: 10.1002/mame.202100560
Xiaojie Lv _{1,

2} , Jingjing Wang _{1,

2} , Danning Ding _{1,

2} , Jiaojiao Liang _{1,

2} , Zhongzheng Zhao _{1,

2} , Yuan Liang _{1,

2} , Zhenfei Zhang ₃ , Chunlin Ye ₃ , Yuwei Chen ₄ , Peng Wei ₅ , Yanping Wang _{1,

2} , Yong He _{1,

2,

6} , Yumin Xia _{1,

2}

Affiliation

In this study, a kind of imidazole type poly(ionic liquid) ([PEP-MIM]Cl) is synthesized, which can disperse carbon effectively. [PEP-MIM]Cl is used as an intermediate to coat carbon on the poly(acrylic acid)(PAA-co-MBA) via ion exchange to obtain conductive polymer composite (CPC). A series of characterizations are performed. Experiments show that carbon can be coated on the PAA-co-MBA uniformly, and compared with using carbon as filler, this method requires less carbon to achieve good conductive performance. The carbon layer on the polymer's surface is enriched via the swelling-shrinking properties of PAA-co-MBA according to the SEM images. Furthermore, in combination with 3D printing technology, PAA-co-MBA can be designed into different shapes to achieve various functions such as pressure-sensing element. Finally, a new type of CPC named carbon clad polymeric laminate (CCPL) is prepared by using the carbon coating method and 3D printing technology. It has the potential to replace copper clad laminate (CCL) and printed circuit board (PCB), to a certain extent. This technology expands the preparation method and application of the CPC such as flexible and wearable conductive fabrics.

中文翻译：

以聚（离子液体）作为非共价中间体的 3D 打印导电复合材料以制造碳电路

本研究合成了一种咪唑型聚（离子液体）（[PEP-MIM]Cl），可以有效地分散碳。[PEP-MIM]Cl用作中间体，通过离子交换将碳包覆在聚（丙烯酸）（PAA- co- MBA）上，得到导电聚合物复合材料（CPC）。执行一系列表征。实验表明，碳可以均匀地包覆在PAA- co- MBA上，与使用碳作为填料相比，这种方法需要的碳更少，以获得良好的导电性能。根据 SEM 图像，聚合物表面的碳层通过 PAA- co- MBA的溶胀收缩特性富集。此外，结合3D打印技术，PAA- co-MBA可以设计成不同的形状来实现压力传感元件等各种功能。最后，采用碳包覆法和3D打印技术制备了一种新型CPC，称为碳包覆聚合物层压板（CCPL）。它有潜力在一定程度上取代覆铜板 (CCL) 和印刷电路板 (PCB)。该技术拓展了柔性可穿戴导电织物等CPC的制备方法和应用。

更新日期：2021-09-14

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