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Digital Process Chain for Processing of Bend-Sensitive Functional Structures on a Flexible Substrate
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2021-08-02 , DOI: 10.1109/tcpmt.2021.3101910
Rafat Saleh , Ferdinand Mohn , Maximilian Barth , Wolfgang Eberhardt , Andre Zimmermann

System-in-foil technology continues to realize relevance in industry and research. In this article, a digital process chain for the fabrication of bend-sensitive sensor structures on a flexible polyimide foil is described. This means that none of the steps in this process chain requires the manufacturing of a structured mask or cliché. Therefore, an arbitrary layout can be manufactured and easily be changed without major effort. Patterning of the sensor layout is realized by direct imaging of a laminated dry film photoresist. The sensor structure is fabricated by a liftoff process using sputtering of a NiCr layer. Finally, the sensor structures are characterized by a static bending test.

中文翻译:

用于在柔性基板上加工弯曲敏感功能结构的数字工艺链

箔系统技术继续在工业和研究中实现相关性。在本文中,描述了在柔性聚酰亚胺箔上制造弯曲敏感传感器结构的数字工艺链。这意味着该工艺链中的任何步骤都不需要制造结构化掩模或陈词滥调。因此,可以在不费力的情况下制造和容易地改变任意布局。传感器布局的图案化是通过层压干膜光刻胶的直接成像来实现的。传感器结构是通过使用溅射镍铬层的剥离工艺制造的。最后,传感器结构的特点是静态弯曲测试。
更新日期:2021-09-14
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