Heat dissipation of the fan-out (FO) package is a primary concern in advanced electronic packaging. It is a challenge to characterize the thermal performance using the actual geometry of the FO package due to the complex structure and time-consuming calculations. A simplified FO model was constructed based on the equivalent material principle and the mathematical FO model was validated by using the finite element (FE) simulation. Then FO-package thermal resistance network (FO-TRN) was established to evaluate the thermal performance, which was proven efficient and accurate by the simulation of FE models. The influence of the critical dimension (CD) of redistribution line (RDL), the thermal conductivity of molding material, and the printed circuit board (PCB) area were also investigated by using the FE simulation and FO-TRN calculation. The results demonstrated that the smaller the CD of RDLs, the greater the thermal resistance of the FO package. The high thermal conductivity of the molding compound and large PCB area is beneficial for heat dissipation. The simplified FO model and FO-TRN are practicable and effective for thermal characterization and management.

中文翻译：

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扇出 3D 封装模型的散热推导和优化


扇出 (FO) 封装的散热是先进电子封装中的首要问题。由于结构复杂且计算耗时，使用 FO 封装的实际几何形状来表征热性能是一项挑战。基于等效材料原理构建了简化的FO模型，并通过有限元（FE）仿真对数学FO模型进行了验证。然后建立FO封装热阻网络（FO-TRN）来评估热性能，通过有限元模型的仿真证明该网络是高效且准确的。通过有限元模拟和 FO-TRN 计算，还研究了再分布线 (RDL) 的临界尺寸 (CD)、成型材料的导热率和印刷电路板 (PCB) 面积的影响。结果表明，RDL 的 CD 越小，FO 封装的热阻越大。模塑料的高导热率和大的PCB面积有利于散热。简化的FO模型和FO-TRN对于热表征和管理来说是实用且有效的。