Ohmic heating (OH) is an alternative thermal processing technique, which is widely used to pasteurize or sterilize food. However, sublethally injured Staphylococcus aureus induced by OH is a great concern to food safety. The recovery of injured S. aureus by OH and virulence factor changes during recovery were investigated in this study. The liquid media (phosphate-buffered saline, buffered peptone water and nutrient broth (NB)), temperature (4, 25 and 37 °C) and pH (6.0, 7.2 and 8.0) influenced the recovery rate and the injured cells completely repaired in NB at 37 °C, pH 7.2 with the shortest time of 2 h. The biofilm formation ability, mannitol fermentation, hemolysis, and coagulase activities decreased in injured S. aureus and recovered during repair process. Quantitative real-time PCR showed the expression of sek, clfB and lukH involved in virulence factors increased during recovery. The results indicated that the virulence factors of injured S. aureus recovered after repair.

欧姆加热 (OH) 是一种替代的热处理技术，广泛用于对食品进行巴氏杀菌或灭菌。然而，OH 诱导的金黄色葡萄球菌亚致死损伤是食品安全的一个重要问题。本研究调查了 OH对受伤金黄色葡萄球菌的恢复和恢复过程中毒力因子的变化。液体培养基（磷酸盐缓冲盐水、缓冲蛋白胨水和营养肉汤 (NB)）、温度（4、25 和 37 °C）和 pH（6.0、7.2 和 8.0）影响恢复率，受损细胞在NB 在 37 °C，pH 7.2，最短时间为 2 小时。受伤的金黄色葡萄球菌生物膜形成能力、甘露醇发酵、溶血和凝固酶活性降低并在修复过程中恢复。定量实时PCR显示的表达SEK，CL ˚F乙和lukH参与致病因子恢复期间增加。结果表明，修复后损伤金黄色葡萄球菌毒力因子恢复。