Development and Challenges of Thermal Interface Materials: A Review,Macromolecular Materials and Engineering

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Development and Challenges of Thermal Interface Materials: A Review
Macromolecular Materials and Engineering ( IF 4.2 ) Pub Date : 2021-09-12 , DOI: 10.1002/mame.202100428
Zhenye Yuan ₁ , Haoqi Ma ₁ , Mohammed A. Hussien ₁ , Yakai Feng _{1,

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Affiliation

With the development of electronic equipment components in the direction of integration, miniaturization, and intelligence, their increasingly high heat dissipation requirements pose a high challenge to the thermal conductivity (TC) of thermal interface materials (TIMs). Polymer-based composite materials with high TC have gradually been favored because of their good processing performance, low cost, and low density. It is important to summarize the relationship between the problems of low heat conduction and their solutions in relation to polymer-based composite materials. For this purpose, this review comprehensively discusses the basic mechanisms of heat transfer inside polymer-based TIMs, the current challenges, and future prospects for improving TC. Strategies involving surface modification and network construction can reduce interfacial thermal resistance and enhance heat conduction.

中文翻译：

热界面材料的发展与挑战：综述

随着电子设备元器件向集成化、小型化、智能化方向发展，其越来越高的散热要求对热界面材料（TIMs）的热导率（TC）提出了很高的挑战。具有高TC的聚合物基复合材料因其加工性能好、成本低、密度低而逐渐受到青睐。总结聚合物基复合材料的低热传导问题及其解决方案之间的关系很重要。为此，本综述全面讨论了聚合物基 TIM 内部传热的基本机制、当前的挑战以及改善 TC 的未来前景。

更新日期：2021-11-15

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