This study focuses on the fabrication of thermoplastic polyurethane (TPU) composites with high thermal conductivity and dielectric constants, which can be used in electronic devices that are able to store charge and dissipate heat. To fabricate the samples, GO was reduced via sonication, and alumina-encapsulated GO particles were prepared with sonication and high-temperature magnetic stirring for 24 h. The TPU composites were fabricated through the melt extrusion process after removing the moistures via oven drying. The storage of charge is enabled by the high dielectric constant obtained from the APTES-treated alumina-encapsulated GO-TPU composites; the heat dissipation characteristics are found from the high thermal conductivity and thermal image camera of the sample. Surprisingly, the tensile and ductile properties of the composite are promising. The thermal conductivity of the APTES treated alumina encapsulated TPU composite is 3.2 times higher than that of the neat TPU. The dielectric property of the GO containing alumina composites is promisingly higher as compared to all other composites investigated.

本研究侧重于具有高导热性和介电常数的热塑性聚氨酯 (TPU) 复合材料的制造，该复合材料可用于能够储存电荷和散热的电子设备。为了制造样品，通过超声处理还原 GO，并通过超声处理和高温磁力搅拌 24 小时制备氧化铝包裹的 GO 颗粒。通过烘箱干燥去除水分后，通过熔融挤出工艺制造 TPU 复合材料。从 APTES 处理的氧化铝封装的 GO-TPU 复合材料获得的高介电常数使电荷存储成为可能；从样品的高导热性和热像仪中发现了散热特性。出奇，复合材料的拉伸和延展性是有希望的。经APTES处理的氧化铝包封TPU复合材料的热导率是纯TPU的3.2倍。与所有其他研究的复合材料相比，含 GO 的氧化铝复合材料的介电性能有望更高。