Ultrasonic assisted grinding (UAG) is a promising manufacturing technology in processing hard and brittle materials, mostly due to its excellent machining performance. In UAG, improvements in grain trajectory interactions and overlapping stemming from kinematic characteristics were identified as the main reasons for reduced grinding forces and improved processing quality. However, in existing studies, the grinding wheels with disordered abrasive grain distributions and irregular grain protrusion heights were generally used. Consequently, it is difficult to control both the interactions between grain trajectories and overlapping. Aiming to solve this problem, a brazed diamond grinding wheel with defined grain distribution was proposed in this study. The grinding wheel matrix was designed using finite element analysis, while abrasive grain distribution was obtained by kinematic analysis of UAG. Finally, the grinding wheel was prepared using brazing technology and to verify its grinding performance, an electroplated grinding wheel with the identic matrix and abrasive grain size was prepared. Morphology analysis of both grinding wheels has shown that compared to the electroplated grinding wheel, the brazed one has both higher and more uniform grain protrusion height. In the next step, UAG and CG experiments were carried out using the brazed and electroplated grinding wheel. The effects of grain distribution and grinding parameters on the grinding force, force ratio, surface profile wave, and surface roughness were studied. The results have shown that in similar operating conditions the brazed grinding wheel produced smaller grinding force, force ratio, smoother ground surface, and lower surface roughness compared to the electroplated grinding wheel. Additionally, for both grinding wheels, the UAG reduced grinding force, force ratio, surface roughness, and profile wave height. However, it also caused a more extensive ultrasonic vibration effect on grinding compared to the electroplated grinding wheel; its reduction percentage in grinding force was larger, while surface roughness and average height difference for UAG were higher compared to CG.

超声辅助磨削（UAG）是加工硬脆材料的一种很有前途的制造技术，主要是由于其优异的加工性能。在 UAG 中，由于运动学特性导致的晶粒轨迹相互作用和重叠的改进被确定为减少磨削力和提高加工质量的主要原因。然而，在现有研究中，普遍使用磨粒分布紊乱、颗粒突起高度不规则的砂轮。因此，很难同时控制晶粒轨迹和重叠之间的相互作用。为了解决这个问题，本研究提出了一种具有明确晶粒分布的钎焊金刚石砂轮。砂轮矩阵采用有限元分析设计，而磨粒分布是通过UAG的运动学分析得到的。最后，采用钎焊技术制备砂轮并验证其磨削性能，制备了基体和磨料粒度相同的电镀砂轮。两种砂轮的形态分析表明，与电镀砂轮相比，钎焊砂轮具有更高且更均匀的颗粒突起高度。在下一步中，使用钎焊和电镀砂轮进行 UAG 和 CG 实验。研究了晶粒分布和磨削参数对磨削力、力比、表面轮廓波和表面粗糙度的影响。结果表明，在相似的操作条件下，钎焊砂轮产生较小的磨削力、力比、与电镀砂轮相比，磨削表面更光滑，表面粗糙度更低。此外，对于两种砂轮，UAG 都降低了磨削力、力比、表面粗糙度和轮廓波高。但是，与电镀砂轮相比，它也对磨削产生了更广泛的超声波振动效应；与CG相比，其磨削力的降低百分比更大，而UAG的表面粗糙度和平均高度差更高。