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The effect of microstructural aspects of WCu composites on electrical conductivity and thermal erosion
International Journal of Refractory Metals & Hard Materials ( IF 3.6 ) Pub Date : 2021-09-10 , DOI: 10.1016/j.ijrmhm.2021.105685
Ahmad Ghaderi Hamidi 1 , Hosein Arabi 2 , Saeed Rastegari 2
Affiliation  

Molten copper infiltration through tungsten skeleton produces Wsingle bondCu composites with versatile applications. In this research, the compressibility and sintering of three W powders with different particle sizes (fine: 1.2 μm, medium: 6 μm, coarse: 8.5 μm) were studied, and 80 vol%W composite specimens were produced from the various primary tungsten powders. The microstructure and electrical conductivity of composites were examined, and a model was successfully developed to establish a relationship between microstructural aspects and electrical conductivity. In addition, the Wsingle bondCu composites were exposed to a high-velocity oxyacetylene flame to evaluate the thermal erosion resistance. Results showed that in addition to density, microstructural aspects have significant effects on conductivity and thermal erosion resistance of Wsingle bondCu composites. The larger copper channels in Wsingle bondCu composites provided higher conductivity and also higher erosion resistance. In addition, the uniformity of channels walls had the same effects. These microstructural aspects affected on evaporation of the copper phase and the transpiration cooling.



中文翻译:

WCu 复合材料的微观结构方面对导电性和热侵蚀的影响

熔融铜通过钨骨架渗透产生单键具有多种用途的钨铜复合材料。在本研究中,研究了三种不同粒径(细:1.2 μm,中:6 μm,粗:8.5 μm)的钨粉的可压缩性和烧结性,并从各种原生钨粉中制备了 80 vol%W 的复合试样. 检查了复合材料的微观结构和电导率,并成功开发了一个模型来建立微观结构方面和电导率之间的关系。此外,W单键将铜复合材料暴露于高速氧乙炔火焰中以评估其抗热侵蚀性。结果表明,除密度外,微观结构方面对钨单键铜复合材料的导电性和抗热侵蚀性也有显着影响。W 单键Cu 复合材料中较大的铜通道提供了更高的导电性和更高的耐腐蚀性。此外,通道壁的均匀性也有同样的效果。这些微观结构方面影响了铜相的蒸发和蒸腾冷却。

更新日期:2021-09-14
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