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Impact of SiN passivation film stress on electroluminescence characteristics of AlGaN/GaN high-electron-mobility transistors
Applied Physics Express ( IF 2.3 ) Pub Date : 2021-09-02 , DOI: 10.35848/1882-0786/ac1f40
Qiang Ma 1 , Shiyo Urano 1 , Yuji Ando 2 , Atsushi Tanaka 2 , Akio Wakejima 1
Affiliation  

This letter reports an impact of SiN film stress on electroluminescence (EL) of AlGaN/GaN HEMTs. The EL color of HEMTs turned from high-intensity white to low-intensity red, as the SiN film stress was increased from −24.2 (compressive) to +11.5MPa (tensile). The weak reddish EL from the HEMT with a film stress of +11.5MPa turned bright whitish when a drain-to-source voltage (V ds) was increased. A transient I d response after biasing stress revealed that severe current collapse emerged in the HEMT with a film stress of −24.2MPa. In addition, the current collapse in HEMTs increased with the increased V ds.



中文翻译:

SiN钝化膜应力对AlGaN/GaN高电子迁移率晶体管电致发光特性的影响

这封信报告了 SiN 薄膜应力对 AlGaN/GaN HEMT 的电致发光 (EL) 的影响。随着 SiN 薄膜应力从 -24.2(压缩)增加到 +11.5MPa(拉伸),HEMT 的 EL 颜色从高强度白色变为低强度红色。当漏源电压(V ds)增加时,来自具有+11.5MPa 薄膜应力的 HEMT 的微红色 EL 变成亮白色。偏置应力后的瞬态I d响应表明 HEMT 中出现了严重的电流崩溃,薄膜应力为 -24.2MPa。此外,HEMT 中的电流崩溃随着V ds 的增加而增加。

更新日期:2021-09-02
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