High quality and reliability of integrated circuit packaging is required for automotive applications due to the safety concerns. Therefore, elimination and controlling the package defects which can lead to reliability failure is essential. One of the defects that leads to reliability issue is delamination. This study presents the influence of textured leadframe surfaces on the surface wettability and delamination occurrence in automotive package unit. Standard bare Cu leadframe was used as comparison. The leadframe surface was textured with Ni/Pd/Au-Ag using electroplating technique. The surface morphologies of both bare and textured leadframe were characterized using field-emission scanning electron microscope and optical profiler. The energy dispersive spectroscopy was used to quantify the elemental composition of the samples. All samples went through the wettability test under two conditions, which were room temperature and 175C. The reliability test of complete package was subjected to moisture sensitivity preconditioning level 1 according to IPC/JEDEC STD 020 and the baking process was performed at 125C for 24hrs followed by soaking process under the condition of 85C and 85 of relative humidity. Scanning acoustic tomography according to IPC/JEDEC STD 035 was performed after three cycles of infrared reflow at 260C. Higher surface roughness was observed for pre-plated leadframe (PPF) compared with bare leadframe. The lowest value of average contact angle (∼55) was observed for PPF at 175C indicated better wettability feature. Furthermore, no delamination occurrence was observed for PPF sample compared with bare copper leadframe. The obtained result reveals that leadframe with textured surface of Ni/Pd/Au-Ag improved interfacial surface adhesion which eliminated the delamination defect and thus improved the package robustness and reliability.

出于安全考虑，汽车应用需要高质量和高可靠性的集成电路封装。因此，消除和控制可能导致可靠性失效的封装缺陷至关重要。导致可靠性问题的缺陷之一是分层。本研究介绍了带纹理的引线框架表面对汽车封装单元中表面润湿性和分层发生的影响。标准裸铜引线框架用作比较。引线框架表面使用电镀技术用 Ni/Pd/Au-Ag 纹理化。使用场发射扫描电子显微镜和光学轮廓仪表征裸引线框架和纹理引线框架的表面形貌。能量色散光谱用于量化样品的元素组成。所有样品均在室温和175℃两种条件下进行润湿性测试。完整封装的可靠性测试根据IPC/JEDEC STD 020进行1级湿敏预处理，烘烤过程在125℃下进行24小时，然后在85℃和85的相对湿度条件下进行浸泡过程。根据 IPC/JEDEC STD 035 的扫描声学断层扫描在 260C 下进行三个红外回流循环后进行。与裸引线框架相比，预镀引线框架 (PPF) 的表面粗糙度更高。在 175C 下观察到 PPF 的平均接触角的最低值 (~55) 表明具有更好的润湿性特征。此外，与裸铜引线框架相比，PPF 样品没有出现分层。