A packaging approach for cost-effective and ultrathin high-power phosphor-based white light-emitting-diode (WLED) emitters with outstanding reliability is presented. By removing the encapsulant in the conventional method, the new approach employs a single silicone-phosphor thin layer instead of multiple phosphor layers in chip-scale package (CSP) WLED for both encapsulations, as well as wavelength conversion. It is demonstrated that the presented WLEDs exhibit superior optical and thermal performance and lifetime durability. Accordingly, the present work offers a high reliability, cost-effective alternative approach for ultrathin high power WLED emitters with significant advantages over the conventional packaging structure and chip-scale packaging methods.

中文翻译：

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开发经济高效的超薄可靠高功率白光 LED 发射器


提出了一种具有成本效益、超薄高功率荧光粉白色发光二极管 (WLED) 发射器的封装方法，并且具有出色的可靠性。通过去除传统方法中的密封剂，新方法在芯片级封装 (CSP) WLED 中采用单个硅磷光体薄层而不是多个磷光体层来进行封装和波长转换。事实证明，所提出的 WLED 具有卓越的光学和热性能以及使用寿命。因此，本工作为超薄高功率WLED发射器提供了一种高可靠性、经济高效的替代方法，与传统封装结构和芯片级封装方法相比具有显着优势。