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Call for papers: Special issue on Solid-State Image Sensors
IEEE Transactions on Device and Materials Reliability ( IF 2.5 ) Pub Date : 2021-09-03 , DOI: 10.1109/tdmr.2021.3109495


Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.

中文翻译:


征文:固态图像传感器特刊



未来的作者被要求提交新的、未发表的手稿,以纳入本次征文中描述的即将举行的活动中。
更新日期:2021-09-03
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