The paper presents the results of investigation of thermal characteristics of a flat evaporator 10 mm thick with an active zone of 27 cm² that is part of a copper–water loop heat pipe (LHP) intended for cooling systems of high-power electronic components. The investigation of the device was conducted in a horizontal position with heat sources having thermocontact surfaces of 9 cm², 16 cm² and 25 cm² at heat load from 20 to 900 W. It is shown that the evaporator thermal resistance and the heat flux depend considerably on the value of the thermocontact surface of the heat sources. The minimum values of thermal resistance were, respectively, 0.033, 0.021 and 0.016 °C/W at heat fluxes of 100, 56.2 and 36 W/cm². The temperature distribution over the evaporator surface with different heat sources has been obtained in analytical way.

本文介绍了一个 10 毫米厚的平面蒸发器的热特性研究结果，该蒸发器是用于大功率电子元件冷却系统的铜水回路热管 (LHP) 的一部分，有源区为 27 cm ²。该装置的研究是在水平位置进行的，热源具有 9 cm ²、16 cm ²和 25 cm ²的热接触面，在 20 到 900 W 的热负荷下。结果表明蒸发器的热阻和热通量很大程度上取决于热源的热接触面的值。在热通量为 100、56.2 和 36 W/cm ^{2 时}，热阻的最小值分别为 0.033、0.021 和 0.016 °C/W. 以解析的方式获得了具有不同热源的蒸发器表面的温度分布。