The ultrasonic elliptical vibration cutting (UEVC) technique has been found to be a promising technique for ultra-precision machining of microstructural functional surfaces. However, the current UEVC technique can not achieve higher frequency ultrasonic cutting due to its rigid orthogonal vibration transmission. To further study the characteristics in high-frequency UEVC of microstructural surface, the UEVC based on flexible guided wave transmission is proposed which can achieve 96.8 kHz. The influence of bending vibration of guided wave band on longitudinal vibration is elaborated with the model of the bending vibration dynamic model of the guided wave. The model of elliptical trajectory deflection of tool tip is established. Based on the theoretical modeling and finite element simulation, the residual height and material removal characteristics of elliptic trajectory with variable deflection angle are simulated and analyzed. The results show that when the deflection angle is between 10^∘ and 70^∘, the tangential force is small and stable. Finally, the cutting experiments of micro-pyramid reflective mold in guided wave UEVC and conventional cutting (CC) are carried out. Compared with CC, high-frequency UEVC can obtain micro-pyramid elements with average roughness of 5.21 nm, which verifies the applicability of high-frequency UEVC in precision machining of microstructure.

超声椭圆振动切割 (UEVC) 技术已被发现是一种用于微结构功能表面超精密加工的有前途的技术。然而，目前的 UEVC 技术由于其刚性正交振动传输，无法实现更高频率的超声切割。为进一步研究微结构表面高频UEVC的特性，提出了基于柔性导波传输的UEVC，其频率可达96.8 kHz。以导波弯曲振动动力学模型为例，阐述了导波带弯曲振动对纵向振动的影响。建立了刀尖椭圆轨迹偏转模型。基于理论建模和有限元仿真，对变偏转角椭圆轨迹的残余高度和材料去除特性进行了仿真分析。结果表明，当偏转角在 10^∘和 70 ^∘，切向力小且稳定。最后，进行了导波UEVC和常规切割（CC）中微金字塔反射模具的切割实验。与CC相比，高频UEVC可以获得平均粗糙度为5.21 nm的微金字塔元件，验证了高频UEVC在微结构精密加工中的适用性。