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Solvent-assisted encapsulation of boron nitride in polystyrene for high-efficient heat dissipation
Polymer Testing ( IF 5.0 ) Pub Date : 2021-09-02 , DOI: 10.1016/j.polymertesting.2021.107325
Weifang Han 1 , Mengyuan Chen 2 , Wei Li 1 , Yuchao Li 1 , Chunhua Ge 3 , Xiangdong Zhang 3
Affiliation  

The actual application of polymer-based composites is obstructed by low thermal conductivity (TC) due to the weaker interfacial affinity and unordered distribution of filler. Herein, we report a breakthrough of heat transfer enabled by sulfonated polystyrene nanospheres-coated hydroxylated boron nitride (BN–OH/SPS) microrods with highly ordered structures via inorganic acid-assisted assembly and following a hot press process. Benefiting from the ordered structure, accumulated heat can rapidly dissipate from the continuous BN–BN thermal conduction pathway in the PS matrix. The in-plane TC of BN-OH/SPS composite with 10 wt% BN reaches up to 8.512 W/mK, which is nearly 45 times larger than that of neat PS. Additionally, BN-OH/SPS composite exhibits excellent mechanical properties. Remarkably, this appealing strategy can be used as a general fabrication method to overcome the challenge of low TC for polymer-based composites.



中文翻译:

聚苯乙烯中氮化硼的溶剂辅助封装以实现高效散热

由于填料的界面亲和力较弱和无序分布,聚合物基复合材料的实际应用受到低导热率(TC)的阻碍。在此,我们报告了通过无机酸辅助组装和热压工艺获得的具有高度有序结构的磺化聚苯乙烯纳米球包覆羟基氮化硼(BN-OH/SPS)微棒实现的传热突破。受益于有序结构,积累的热量可以从 PS 基体中连续的 BN-BN 热传导路径快速消散。含 10 wt% BN 的 BN-OH/SPS 复合材料的面内 TC 高达 8.512 W/mK,比纯 PS 大近 45 倍。此外,BN-OH/SPS 复合材料表现出优异的机械性能。值得注意的是,

更新日期:2021-09-04
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