An Electrostatic Discharge (ESD) causes physical defects in electrical devices and lowers their production yield. As electrostatic charge is maintained on insulative surfaces, ESD protection materials, especially surface treatment protection solutions, are in high demand in the electrical industry. Diamond-Like Carbon (DLC) film shows sp³ (insulative) and sp² (conductive) structures whose resistivity is adjustable to the ESD protection range according to the sp³/sp² ratio. In this study, two types of hydrogenated DLCs on conductive and non-conductive substrates were prepared by Linear Ion Source and Plasma Immersion Ion Implantation. The protective properties against ESD, such as resistance and the slow discharge behavior of DLCs on metal and insulative substrates, as well as their tribological properties and structure, were investigated. It was shown that DLCs on insulative materials exhibit good and slow discharge properties to protect electrical devices from ESD damage. The promotion of DLCs in the semiconductor industry could be an excellent solution to raise production yield due to their provision of ESD protection and their good tribological properties.

静电放电 (ESD) 会导致电气设备出现物理缺陷并降低其产量。由于绝缘表面上会保持静电荷，因此电气行业对 ESD 保护材料，尤其是表面处理保护解决方案的需求量很大。类金刚石碳 (DLC) 薄膜显示 sp ³（绝缘）和 sp ²（导电）结构，其电阻率可根据 sp ³ /sp ²调整到 ESD 保护范围比率。在这项研究中，通过线性离子源和等离子体浸入离子注入在导电和非导电基材上制备了两种类型的氢化 DLC。研究了抗 ESD 的保护特性，例如 DLC 在金属和绝缘基材上的电阻和缓慢放电行为，以及它们的摩擦学特性和结构。结果表明，绝缘材料上的 DLC 表现出良好且缓慢的放电特性，可保护电气设备免受 ESD 损坏。由于 DLC 提供 ESD 保护和良好的摩擦学特性，因此在半导体行业中推广 DLC 可能是提高产量的绝佳解决方案。