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One-Step Fabrication of Low-Resistance Conductors on 3D-Printed Structures by Laser-Induced Graphene
ACS Applied Electronic Materials ( IF 4.3 ) Pub Date : 2021-08-31 , DOI: 10.1021/acsaelm.1c00480
Mehraneh Tavakkoli Gilavan 1 , Md Saifur Rahman 1, 2 , Aamir Minhas-Khan 1 , Suresh Nambi 1 , Gerd Grau 1
Affiliation  

Three-dimensional (3D) printing is becoming increasingly prevalent in the manufacturing of goods for different applications. Many of these applications will benefit from the integration of electronics into 3D-printed structures. In this study, we report a fabrication method to convert 3D-printed polyetherimide (PEI) into graphene by exposing it to a scanned laser beam. This laser-induced graphene (LIG) is not only conductive but also has a large gauge factor for mechanical strain sensing. We have achieved a sheet resistance of 0.30 Ω/sq which is 50 times lower than that of previous reports on 3D-printed PEI/PC sheets and the lowest LIG sheet resistance value reported to date on any polymer substrate. This is achieved due to three main factors: large thickness of LIG on a 3D-printed object, maximization of the laser energy per unit area, and improved LIG morphology on 3D-printed PEI compared with that on commercial PEI.

中文翻译:

通过激光诱导石墨烯在 3D 打印结构上一步制造低电阻导体

三维 (3D) 打印在不同应用的商品制造中变得越来越普遍。其中许多应用将受益于将电子设备集成到 3D 打印结构中。在这项研究中,我们报告了一种通过将 3D 打印的聚醚酰亚胺 (PEI) 暴露在扫描激光束下将其转化为石墨烯的制造方法。这种激光诱导石墨烯 (LIG) 不仅具有导电性,而且还具有用于机械应变传感的大应变系数。我们已经实现了 0.30 Ω/sq 的薄层电阻,这比之前关于 3D 打印的 PEI/PC 薄板的报告低 50 倍,并且是迄今为止在任何聚合物基板上报告的最低 LIG 薄层电阻值。这是由于三个主要因素实现的:3D 打印物体上的 LIG 厚度大、单位面积的激光能量最大化、
更新日期:2021-09-28
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