Miniaturized electronic devices with high power-density are a key contributor to the booming electronics field, which requires effective heat removal through polymer-based composites. However, their low thermal conductivity remains a great challenge. Herein, we have developed a new Cu-plated PEEK/carbon fiber felt (PEEK/CF-Cu) based e-composite material with excellent heat dissipation properties through electroplating Cu network on 3D PEEK/CF felt skeletons, combined with simple a vacuum hot-pressing method. This demonstrates that the 3D PEEK/CF-Cu composites exhibit high in-plane thermal conductivity of 5.48 W/(m·K) and superior through-plane thermal conductivity (2.54 W/(m·K)), along with excellent electrical conductivity (3.2 × 10⁴ S/cm) with a Cu loading of 27.1 vol% and high storage modulus. Additionally, the strong heating and cooling capacity of the 3D PEEK/CF-Cu composites was confirmed through infrared thermal imaging. Our work provides a unique method for fabricating 3D high thermal conductive PEEK-based composites, which is different from traditional methods, indicating future potential for broad application in thermal management and antistatic materials.

具有高功率密度的小型化电子设备是蓬勃发展的电子领域的关键因素，这需要通过基于聚合物的复合材料进行有效的散热。然而，它们的低导热性仍然是一个巨大的挑战。在此，我们通过在 3D PEEK/CF 毛毡骨架上电镀铜网络，结合简单的真空热——压制法。这表明 3D PEEK/CF-Cu 复合材料具有 5.48 W/(m·K) 的高平面热导率和优异的平面热导率 (2.54 W/(m·K))，以及优异的导电性(3.2 × 10 ⁴ S/cm) 的 Cu 负载量为 27.1 vol% 和高储能模量。此外，通过红外热成像证实了 3D PEEK/CF-Cu 复合材料的强大加热和冷却能力。我们的工作为制造 3D 高导热 PEEK 基复合材料提供了一种独特的方法，该方法不同于传统方法，表明未来在热管理和抗静电材料中具有广泛应用的潜力。