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Fused filament fabrication process window for good interlayer bonding: Application to highly filled polymers in metallic powder*
Polymer Engineering and Science ( IF 3.2 ) Pub Date : 2021-08-30 , DOI: 10.1002/pen.25781
Alexis Thézé 1, 2 , Alain Guinault 1 , Gilles Régnier 1 , Sébastien Richard 2 , Bruno Macquaire 2
Affiliation  

Extending the fused filament fabrication process to highly filled thermoplastics in metallic powder used in metal injection molding is a promising method to produce small series. However, the lack of adhesion between deposited filaments can cause ruptures during the fabrication or debinding process. We designed a simple device to measure the shear strength required to tear off a filament deposited on a substrate. This device makes it possible to quickly determine the processing window for a good welding of filaments. We developed a 2D thermal simulation using the finite difference method while integrating the enthalpy of fusion and crystallization kinetics of the material. We then fitted it to the thermal measurements at depths of 0.45 and 0.75 mm under the substrate surface using small-diameter thermocouples. Simulation results highlight the key role of the thermal contact resistance between the filament and the substrate in the evolution of the interface temperature. This provides essential information to explain the process window that can be determined experimentally. The characteristic time of macromolecule diffusion was determined by rheological measurements and was found to be too small to play a role in filament bonding for the simulated cooling rates for the studied material. The methodology introduced in this work was used to improve highly filled polymers interlayer adhesion, but it can be used to improve other filled or unfilled polymers.

中文翻译:

用于良好层间粘合的熔丝制造工艺窗口:应用于金属粉末中的高填充聚合物*

将熔丝制造工艺扩展到用于金属注射成型的金属粉末中的高填充热塑性塑料是一种很有前途的小批量生产方法。然而,沉积的细丝之间缺乏粘合力会导致制造或脱脂过程中的破裂。我们设计了一个简单的装置来测量撕下沉积在基材上的细丝所需的剪切强度。该设备可以快速确定灯丝良好焊接的加工窗口。我们使用有限差分法开发了二维热模拟,同时整合了材料的熔化焓和结晶动力学。然后,我们使用小直径热电偶将其拟合到基板表面下方 0.45 和 0.75 mm 深度处的热测量值。模拟结果突出了灯丝和基板之间的热接触电阻在界面温度演变中的关键作用。这提供了解释可以通过实验确定的过程窗口的基本信息。大分子扩散的特征时间由流变测量确定,发现对于所研究材料的模拟冷却速率而言,大分子扩散的特征时间太小而无法在长丝粘合中发挥作用。这项工作中介绍的方法用于改善高度填充的聚合物层间粘合力,但它也可用于改善其他填充或未填充的聚合物。这提供了解释可以通过实验确定的过程窗口的基本信息。大分子扩散的特征时间由流变测量确定,发现对于所研究材料的模拟冷却速率而言,大分子扩散的特征时间太小而无法在长丝粘合中发挥作用。这项工作中介绍的方法用于改善高度填充的聚合物层间粘合力,但它也可用于改善其他填充或未填充的聚合物。这提供了解释可以通过实验确定的过程窗口的基本信息。大分子扩散的特征时间由流变测量确定,发现对于所研究材料的模拟冷却速率而言,大分子扩散的特征时间太小而无法在长丝粘合中发挥作用。这项工作中介绍的方法用于改善高度填充的聚合物层间粘合力,但它也可用于改善其他填充或未填充的聚合物。
更新日期:2021-08-30
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